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| 型號(hào)： | AM42BDS6408G |
| 英文描述： | 250NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM) |
| 中文描述： | Am42BDS6408G -堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁(yè)數(shù)： | 71/73頁(yè) |
| 文件大?。?/td> | 1080K |
| 代理商： | AM42BDS6408G |
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70
Am42BDS6408G
November 1, 2002
P R E L I M I N A R Y
PHYSICAL DIMENSIONS
FLB093—93-Ball Fine-Pitch Grid Array 8 x 11.6 mm
3186\38.14A
N/A
8.00 mm x 11.60 mm
PACKAGE
NOM.
---
---
---
11.60 BSC.
FLB 093
1.40
---
1.09
MAX.
8.00 BSC.
8.80 BSC.
7.20 BSC.
12
---
0.25
MIN.
0.90
10
93
0.35
0.40
0.40 BSC
A2,A3,A4,A5,A6,A7,A8,A9
C10,D1,D10,E1,E10,H1,H10
J1,J10,K1,K10
M2,M3,M4,M5,M6,M7,M8,M9
0.30
0.80 BSC
0.80 BSC
ME
n
D
E
JEDEC
PACKAGE
SYMBOL
A
A1
A2
MD
D1
E1
NOTE
DEPOPULATED SOLDER BALL
MATRIX SIZE E DIRECTION
BALL COUNT
MATRIX FOOTPRINT
MATRIX FOOTPRINT
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
BODY SIZE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
PROFILE
BALL DIAMETER
MATRIX SIZE D DIRECTION
eE
eD
SD/SE
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTION OR OTHER MEANS.
b
O
93X
6
b
0.20 C
C
0.15 M C
0.08
M C
A B
C
SIDE VIEW
A2
A1
A
0.08
10
INDEX MARK
C
0.15
(2X)
(2X)
C
0.15
B
A
D
E
PIN A1
CORNER
TOP VIEW
BOTTOM VIEW
L
M
eD
CORNER
E1
7
SE
D1
A
B
D C
E
F
H G
10
9
8
7
6
5
4
3
2
1
J
K
eE
SD
PIN A1
7
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| AM42BDS6408GBD8IT | 制造商:Spansion 功能描述:COMBO 4MX16 FLASH + 512KX16 SRAM 1.8V 93FBGA - Tape and Reel |
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| AM42BDS6408HD3I | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory, and 8 Mbit (512 K x 16-Bit) SRAM |
| AM42BDS6408HD4I | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory, and 8 Mbit (512 K x 16-Bit) SRAM |
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