參數(shù)資料
型號(hào)： IBM25PPC970FX6UB267ET
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 1800 MHz, RISC PROCESSOR, CBGA576
封裝： 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-576
文件頁(yè)數(shù)： 44/78頁(yè)
文件大?。?/td> 3524K
代理商： IBM25PPC970FX6UB267ET
Datasheet
PowerPC 970FX RISC Microprocessor
Version 2.5
March 26, 2007
Dimensions and Physical Signal Assignments
Page 49 of 78
4.2.2.1 Mechanical Specifications
The solder balls on the bottom of the reduced-lead package are slightly smaller, which will decrease the
overall module height when assembled onto a system board. Heatsink solutions should be modified accord-
ingly
.
4.2.2.2 Assembly Considerations
The reduced-lead package is compatible with a 260
°C lead-free card assembly reflow profile. See the Inter-
national Electronics Manufacturing Initiative (iNEMI) Consortium, www.inemi.org, for industry-standard
assembly and rework information. The coplanarity specification for the reduced-lead CBGA, like other single
melt BGA packages, is 0.20 mm (8 mil). The qualification testing included a lead-free, water-soluble solder
paste with type 3 mesh size (-325
±500). The solder alloy is 95.5% Sn, 4.0% Ag, and 0.5% Cu, with a 90%
metal loading. The paste viscosity range is 600 to 800 thousands of centipoises (kcps). The thickness of the
stencil is 4 mils and the aperture diameter is 23 mils. The target solder paste volume range is between 1400
to 2000 cubic mils. Achieving the correct paste volume is necessary to eliminate solder shorts and produce
high reliability solder joints. The actual solder paste volume from the qualification build ranged from 1750 to
2000 cubic mils.
The JEDEC moisture sensitivity level is MSL 3 for the reduced-lead package. Storage and assembly proto-
cols should be modified accordingly.
Figure 4-4 on page 50 and Figure 4-5 on page 51 show the side and top views of the packages including the
height from the top of the die to the bottom of the solder balls. Figure 4-6 on page 52 shows a bottom view of
the PowerPC 970FX.
Table 4-1. Standard-Lead and Reduced-Lead Package, Layout, and Assembly Differences
Package
JEDEC
Moisture
Sensitivity
Level (MSL)
Solder Ball
Composition
Solder Ball
Diameter
mm (inch)
CBGA
Substrate I/O
Pad Diameter
mm (inch)
Card Solder
Mask Opening
Diameter
mm (inch)
Card Solder
Screen
Diameter
Card Pad
Diameter
mm (inch)
Standard Lead
1
Sn 10%
Pb 90%
0.80 (0.0315)
26.5 mil open-
ing in 7.5 mil
thick stencil,
2500-4600
cubic mils
0.70 (0.0275)
Reduced Lead
3
Sn 95.5%
Ag 3.8%
Cu 0.7%
0.635 (0.025)
0.80 (0.0315)
0.72 (0.028)
23 mil opening
in 4 mil thick
stencil, 1400-
2000 cubic mils
0.61 (0.024)
Note: All dimensions in mm unless noted. Dimensions in parenthesis are in inches.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IBM25PPC970FX6UB429RT 制造商:IBM Microelectronics 功能描述:MPU 970FX RISC 64BIT 90NM 1.5V 576CBGA - Trays 制造商:IBM 功能描述:IBM IBM25PPC970FX6UB429RT Co-Processors
IBM25PPC970GX7TR01-ET 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.2GHZ POWER OPTIMIZED - Trays
IBM25PPC970GX7TR05-ET 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.4GHZ POWER OPTIMIZED - Trays
IBM25PPC970GX7TR20-ET 制造商:IBM Microelectronics 功能描述:ANTARES GX DD1.0X 1.6GHZ POWER OPTIMIZED - Trays
IBM25PPC970GX7TR23-ET 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.6GHZ PERFORMANCE OPTIMIZED - Trays
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