參數(shù)資料
型號(hào): IBM25PPC970FX6UB267ET
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 1800 MHz, RISC PROCESSOR, CBGA576
封裝: 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-576
文件頁(yè)數(shù): 42/78頁(yè)
文件大?。?/td> 3524K
代理商: IBM25PPC970FX6UB267ET
D
a
tas
hee
t
Pow
e
rPC
9
7
0
FX
R
ISC
Mi
croproc
ess
or
Vers
ion
2.
5
Marc
h
26,
2007
Dimens
io
n
s
and
Ph
ysical
Signal
A
ssignm
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Page
47
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78
Figure 4-2. PowerPC 970FX Microprocessor Mechanical Package for Standard Lead, DD3.1x Parts (top and side)
Legend
DATUM A is the center plane of the feature labeled DATUM A.
DATUM B is the center plane of the feature labeled DATUM B.
3
Unless otherwise specified, the part is symmetrical about center lines defined by DATUMs A and B.
4
Where not otherwise defined, center lines indicated are to be interpreted as a datum framework, established by DATUM
D, A, and B respectively.
This line defines the approximate boundary configuration of encapsulant as dispensed. For underfill requirements, see
IBM Engineering Specification 71X8781 Module Encapsulation Specification.
1
2
7
Top View
Side View
0.81 ± 0.1
(1.35 MAX)
(1.08 MIN)
(2.26 MAX)
(1.82 MIN)
(8X) (0.59 MAX)
(8X) (1.94 MAX)
(8X) (2.85 MAX)
(0.908 MAX)
(0.779 MIN)
(2.258 MAX)
(1.859 MIN)
(3.168 MAX)
(2.569 MIN)
0.15 C
SEATING PLANE
C
A
CAPACITOR
C4 ENCAPSULANT
FILLET
2
14
CHIP
D
E
5
SOLDERBALL
45L5867 (576)
CAPACITOR (8)
0612 CAPACITOR 5
6
5
7
CHIP
C4 ENCAPSULANT
(2X)
(6.15)
(2X)
(6.15)
(2x) (2.05)
(8X) (1.6)
(2x) (2.05)
32R8131
CHIP CARRIER ASM
A01 CORNER
(CHIP CARRIER)
(4X
)
(3
.2
)
(4
X
)
(6.61
)
(4X
)
(6
.6
1
)
(4
X
)
(3
.2
)
( 9.4 )
2
( 25 ± 0.2 )
A
B
1
(25
±
0.
2
)
(7.1
)
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