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| 型號(hào)： | IBM25PPC970FX6UB267ET |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 1800 MHz, RISC PROCESSOR, CBGA576 |
| 封裝： | 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-576 |
| 文件頁(yè)數(shù)： | 15/78頁(yè) |
| 文件大?。?/td> | 3524K |
| 代理商： | IBM25PPC970FX6UB267ET |
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Datasheet
PowerPC 970FX RISC Microprocessor
Electrical and Thermal Characteristics
Page 22 of 78
Version 2.5
March 26, 2007
3.1.3 Package Thermal Characteristics
I/O supply current, maximum
OIDD
2A
Input voltage
VIN
GND to OVDD
V
Thermal diode temperature
TDIODE
0 to 105
°C
Table 3-3. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Ceramic ball grid array (CBGA) thermal conductance to
back of die
θJC
0.1
°C/W
CBGA thermal conductance to system board
θJB
5.4
°C/W
Table 3-2. Recommended Operating Conditions (Page 2 of 2)
Characteristic
Symbol
Value
Unit
Notes
Notes:
1. The PLL supply voltage has been adjusted to account for the maximum possible dc drop across the filter circuit. See Section 5.3
PLL Power Supply Filtering on page 66.
2. This is the maximum I/O current. As noted in Table 3-7 Power Consumption Throttle Back F/2 on page 26, the actual I/O power
varies between 1 - 3 watts based on the speed of the processor interface (PI) and whether the on-board termination is used. Typi-
cally it is active, but in cases of the slower parts and layouts with parts in very close proximity, signal analysis might show that the
PI terminations can be turned off.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25PPC970FX6UB429RT | 制造商:IBM Microelectronics 功能描述:MPU 970FX RISC 64BIT 90NM 1.5V 576CBGA - Trays 制造商:IBM 功能描述:IBM IBM25PPC970FX6UB429RT Co-Processors |
| IBM25PPC970GX7TR01-ET | 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.2GHZ POWER OPTIMIZED - Trays |
| IBM25PPC970GX7TR05-ET | 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.4GHZ POWER OPTIMIZED - Trays |
| IBM25PPC970GX7TR20-ET | 制造商:IBM Microelectronics 功能描述:ANTARES GX DD1.0X 1.6GHZ POWER OPTIMIZED - Trays |
| IBM25PPC970GX7TR23-ET | 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.6GHZ PERFORMANCE OPTIMIZED - Trays |
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