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參數(shù)資料
| 型號： | IBM25PPC970FX6UB267ET |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 1800 MHz, RISC PROCESSOR, CBGA576 |
| 封裝： | 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-576 |
| 文件頁數(shù)： | 2/78頁 |
| 文件大?。?/td> | 3524K |
| 代理商： | IBM25PPC970FX6UB267ET |
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Datasheet
PowerPC 970FX RISC Microprocessor
Revision Log
Page 10 of 78
Version 2.5
March 26, 2007
July 15, 2005
Version 1.0
Updated features listing, Table 1-1. PPC 970FX Ordering and PVR for the Leaded Package Version and
Figure 1-2 Part Number Legend.
Added errata list and application note documents to Related Publications.
Updated some of the specifications in Table 3-2. Recommended Operating Conditions.
Updated Section 3.1.5 Power Consumption, modifying the content and form of the specification tables.
Added a note to Figure 3-3. Block Diagram of an SSB for a Processor Interconnect Implementation.
Updated some of the specifications in Section 3.5.1.2 Drive Side Characteristics.
Extensively updated specifications in Table 3-6. Power Consumption for Power-Optimized Parts and
Table 3-7. Power Consumption for Standard Parts.
Updated some of the specifications in Table 3-11. Processor Interconnect SSB Driver Specifications and
Table 3-13. Processor Interconnect SSB Receiver Specifications.
Made major modifications to Table 3-12. Processor Interconnect SSB PCB Trace Specifications, Table 3-
14. Processor Interconnect SSB Timing Parameters for the Deskew and Clock Alignment and Section
3.5.1.4 Receive Side Characteristics.
Added Table 3-17. Input ac Timing Specifications for TBEN.
Added a clarifying note to Section 3.10.1 I2C Bus Timing Information.
Clarified text in Section 3.10.3 I2C and JTAG Considerations.
Updated some of the specifications in Figure 3-10. JTAG Clock Input Timing Diagram.
Made major modifications to Section 3.10.3 I2C and JTAG Considerations, Section 5.7.1 Thermal Man-
agement pins, and Section 5.7.2 Reading Thermal Diode Calibration Data Through JTAG.
Updated Section 4. PowerPC 970FX Microprocessor Dimension and Physical Signal Assignments to
describe both packaging types.
Changed the titles for Figure 4-1. PPC 970FX Microprocessor for Mechanical Package, Leaded, for DD3.0x
Parts (top and side) and Figure 4-2. PPC 970FX Microprocessor Mechanical Package, Leaded, for DD3.1x
Parts (top and side).
Updated Table 5-2. PowerPC 970FX PLL Configuration and Table 5-3. System Configuration - Typical
Examples of Pin Settings.
Added Table 5-9. Thermal Diode Data Encoding.
Updated some of the specifications in Table 5-10. Allowable Forces on the PowerPC 970FX Package.
Revision
Modification
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PDF描述 |
|---|---|
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| IBM26BL486DX2-V80QP | 32-BIT, 80 MHz, MICROPROCESSOR, PQFP208 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25PPC970FX6UB429RT | 制造商:IBM Microelectronics 功能描述:MPU 970FX RISC 64BIT 90NM 1.5V 576CBGA - Trays 制造商:IBM 功能描述:IBM IBM25PPC970FX6UB429RT Co-Processors |
| IBM25PPC970GX7TR01-ET | 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.2GHZ POWER OPTIMIZED - Trays |
| IBM25PPC970GX7TR05-ET | 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.4GHZ POWER OPTIMIZED - Trays |
| IBM25PPC970GX7TR20-ET | 制造商:IBM Microelectronics 功能描述:ANTARES GX DD1.0X 1.6GHZ POWER OPTIMIZED - Trays |
| IBM25PPC970GX7TR23-ET | 制造商:IBM 功能描述:ANTARES GX DD1.0X 1.6GHZ PERFORMANCE OPTIMIZED - Trays |
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