參數(shù)資料
型號: GCIXP1250-200
英文描述: Microprocessor
中文描述: 微處理器
文件頁數(shù): 19/148頁
文件大?。?/td> 1601K
代理商: GCIXP1250-200
Intel
IXP1250 Network Processor
Datasheet
19
BootROM devices may be either 32 bits or 16 bits in width. This is determined by GPIO[3] during
reset. When 16-bit BootROM devices are used, the maximum BootROM address space is reduced
from 8 Mbytes to 4 Mbytes.
Figure 4
details the major components of the SRAM Unit.
The SRAM Bus consists of 19 address bits, 32 data bits, 4 chip enable bits, 8 buffer and read/write
control signals, a synchronous output clock (SCLK) running at one-half the IXP1250 Core
frequency, and a synchronous input clock (NA/SACLK). When using Flowthru SRAM types, it is
recommended to route the SCLK signal from the SRAMs back to the NA/SACLK input. Routing
this trace identically to the DQ data signals will skew the NA/SACLK slightly to track the return
data trace propagation delay. When using Pipelined/DCD SRAMs, the NA/SACLK input is not
used and may be held inactive with a pulldown to GND to save power.
The SRAM Unit receives memory requests from seven sources: the StrongARM* core and each of
the six Microengines. Refer to the IXP1250 Hardware Reference Manual for details on the
prioritization and queues provided for servicing these requests.
The IXP1250 supports the use of an optional asynchronous ready input for flexibility in interfacing
memory-mapped I/O devices to the SRAM Slowport region. This will allow the I/O device to add
wait-states to IXP1250 I/O accesses. This function is supported on the HIGH_EN_L pin. An I/O
device must drive HIGH_EN_L with a wired-OR open drain buffer configuration, and only drive
the pin when the I/O device is selected.
To use the RDY_L pin function, it must be enabled by setting SRAM_CSR[19]=1. The RDY_L
Pause State Value field located in register SRAM_SLOW_CONFIG[23:16] must be programmed
with the state value at which you choose to pause the internal wait-state logic. This pause state
relates to the other timing parameters programmed into the SRAM_SLOW_CONFIG and
Figure 4. SRAM Unit Block Diagram
A8545-01
AMBA[31:0]
(from
StrongARM*
Core)
Microengine
Commands &
Addresses
Microengine Data [63:0]
SRAM
32KB to
8MB
Pipelined-
DCD or
Flowthru
Buffer
SRAM
Pin
Interface
Command
Decoder
& Address
Generator
Service Priority
(Arbitration)
Machine & Registers
AMBA Bus
Interface
Logic
AMBA Address
Rd/Wr Queue
Microengine Address
& Command Queues
(High Priority, Read,
Readlock Fail
and Order)
Memory/
AMBA Data
FIFO
Addr[18:0]
Data[31:0]
RD/WR/EN
Signals
addr
data
* Other names and brands may be claimed as the property of others.
** ARM architecture compatible
BootROM
256KB
to
8 MB
Peripheral
Device
(i.e., MAC
CPU port)
SCLK
相關(guān)PDF資料
PDF描述
GCIXP1250-232 Microprocessor
GCK101 Analog IC
GCK131 Microcontroller
GCM-3.15A Fuse
GCM-4A Fuse
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GCIXP1250BA 功能描述:IC MPU NETWORK 166MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點:- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCIXP1250BB 功能描述:IC MPU NETWORK 200MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點:- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCIXP1250BC 功能描述:IC MPU NETWORK 232MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點:- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCJ0335C5C0JR50D 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitors
GCJ0335C5C1AR50D 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitors