參數(shù)資料
型號: S71WS512NC0BAWA62
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP)
中文描述: 堆疊式多芯片產(chǎn)品(MCP)
文件頁數(shù): 55/188頁
文件大小: 2252K
代理商: S71WS512NC0BAWA62
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁當前第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁
September 15, 2005 S71WS-N_01_A4
S71WS-Nx0 Based MCPs
53
A d v a n c e I n f o r m a t i o n
10.9
Hardware Reset
The RESET# input provides a hardware method of resetting the device to reading array data.
When RESET# is driven low for at least a period of t
RP
, the device immediately terminates any
operation in progress, tristates all outputs, resets the configuration register, and ignores all read/
write commands for the duration of the RESET# pulse. The device also resets the internal state
machine to reading array data.
To ensure data integrity the operation that was interrupted should be reinitiated once the device
is ready to accept another command sequence.
When RESET# is held at V
SS
, the device draws CMOS standby current (I
CC4
). If RESET# is held
at V
IL
, but not at V
SS
, the standby current is greater.
RESET# may be tied to the system reset circuitry which enables the system to read the boot-up
firmware from the Flash memory upon a system reset.
See
Figures
14.5
and
14.12
for timing diagrams.
10.10 Software Reset
Software reset is part of the command set (see
Table 15.1
) that also returns the device to array
read mode and must be used for the following conditions:
1.
2.
to exit Autoselect mode
when DQ5 goes high during write status operation that indicates program or erase cycle was
not successfully completed
exit sector lock/unlock operation.
to return to erase-suspend-read mode if the device was previously in Erase Suspend mode.
after any aborted operations
3.
4.
5.
Note:
Base = Base Address.
The following is a C source code example of using the reset function. Refer to the
Spansion
Low Level Driver User’s Guide
(available on www.amd.com and www.fujitsu.com) for general
information on Spansion Flash memory software development guidelines.
/* Example: Reset (software reset of Flash state machine) */
*( (UINT16 *)base_addr + 0x000 ) = 0x00F0;
The following are additional points to consider when using the reset command:
This command resets the banks to the read and address bits are ignored.
Reset commands are ignored once erasure has begun until the operation is complete.
Once programming begins, the device ignores reset commands until the operation is com-
plete
The reset command may be written between the cycles in a program command sequence be-
fore programming begins (prior to the third cycle). This resets the bank to which the system
was writing to the read mode.
If the program command sequence is written to a bank that is in the Erase Suspend mode,
writing the reset command returns that bank to the erase-suspend-read mode.
The reset command may be also written during an Autoselect command sequence.
If a bank has entered the Autoselect mode while in the Erase Suspend mode, writing the reset
command returns that bank to the erase-suspend-read mode.
Table 10.21 Reset LLD Function = lld_ResetCmd)
Cycle
Operation
Byte Address
Word Address
Data
Reset Command
Write
Base + xxxh
Base + xxxh
00F0h
相關(guān)PDF資料
PDF描述
S71WS512NC0BAWA63 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWA70 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWA72 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWA73 Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWE20 Stacked Multi-Chip Product (MCP)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71WS512NC0BAWA63 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWA70 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWA72 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWA73 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S71WS512NC0BAWAJ0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP)