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參數(shù)資料
| 型號： | S71WS512NC0BAWA62 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 188/188頁 |
| 文件大?。?/td> | 2252K |
| 代理商： | S71WS512NC0BAWA62 |
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186
S71WS-Nx0 Based MCPs
S71WS-N_01_A4 September 15, 2005
A d v a n c e I n f o r m a t i o n
50 Revisions
Revision A (February 1, 2004)
Initial Release
Revision A1 (February 9, 2005)
Updated document to include Burst Speed of 66 Mhz
Updated Publication Number
Revision A2 (April 11, 2005)
Updated Product Selector Guide and Ordering Information tables
Revision A3 (May 13, 2005)
Updated the entire utRAM module
Revision A4 (September 15, 2005)
Added 128-MB module.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary
industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for
any
use
that
includes
fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control,
medical life support system, missile launch control in weapon system), or (2)
for any use where chance of failure is intolerable
(i.e., submersible repeater and
artificial satellite). Please note that Spansion LLC will not be liable
to
you and/or any third party for any claims or damages arising in connection with above-
mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels
and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on ex-
port under the Foreign Exchange and Foreign Trade Law of Japan
, the US Export Administration Regulations or the applicable laws of any other country,
the
prior authorization by
the respective government entity
will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion LLC product under development
by Spansion LLC. Spansion LLC reserves the right to change or discontinue work on any product without notice. The information in this document is provided
as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement
of third-party rights, or any other warranty, express, implied, or statutory. Spansion LLC assumes no liability for any damages of any kind arising out of the
use of the information in this document.
Copyright 2004-2005 Spansion LLC. All rights reserved. Spansion, the Spansion logo, and MirrorBit are trademarks of Spansion LLC. Other company and
product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS512NC0BAWA63 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA72 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA73 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWAJ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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