- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄365459 > S71WS512NC0BAWA62 (Spansion Inc.) Stacked Multi-Chip Product (MCP) PDF資料下載
參數(shù)資料
| 型號(hào)： | S71WS512NC0BAWA62 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁(yè)數(shù)： | 52/188頁(yè) |
| 文件大小： | 2252K |
| 代理商： | S71WS512NC0BAWA62 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)當(dāng)前第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)
50
S71WS-Nx0 Based MCPs
S71WS-N_01_A4 September 15, 2005
A d v a n c e I n f o r m a t i o n
may choose to perform other system tasks. In this case, the system must start at the beginning
of the algorithm when it returns to determine the status of the operation. Refer to
Figure 10.6
for
more details.
Note:
When verifying the status of a write operation (embedded program/erase) of a memory bank,
DQ6 and DQ2 toggle between high and low states in a series of consecutive and con-tiguous
status read cycles. In order for this toggling behavior to be properly observed, the consecu-
tive status bit reads must not be interleaved with read accesses to other memory banks. If it
is not possible to temporarily prevent reads to other memory banks, then it is recommended
to use the DQ7 status bit as the alternative method of determining the active or inactive sta-
tus of the write operation.
DQ5: Exceeded Timing Limits.
DQ5 indicates whether the program or erase time has exceeded
a specified internal pulse count limit. Under these conditions DQ5 produces a “1,” indicating that
the program or erase cycle was not successfully completed. The device may output a “1” on DQ5
if the system tries to program a “1” to a location that was previously programmed to “0.” Only an
erase operation can change a “0” back to a “1.” Under this condition, the device halts the opera-
tion, and when the timing limit has been exceeded, DQ5 produces a “1.”Under both these
conditions, the system must write the reset command to return to the read mode (or to the erase-
suspend-read mode if a bank was previously in the erase-suspend-program mode).
DQ3: Sector Erase Timeout State I ndicator.
After writing a sector erase command sequence,
the system may read DQ3 to determine whether or not erasure has begun. (The sector erase
timer does not apply to the chip erase command.) If additional sectors are selected for erasure,
the entire time-out also applies after each additional sector erase command. When the time-out
period is complete, DQ3 switches from a “0” to a “1.” If the time between additional sector erase
commands from the system can be assumed to be less than t
SEA
, the system need not monitor
DQ3. See Sector Erase Command Sequence for more details.
After the sector erase command is written, the system should read the status of DQ7 (Data# Poll-
ing) or DQ6 (Toggle Bit I) to ensure that the device has accepted the command sequence, and
then read DQ3. If DQ3 is “1,” the Embedded Erase algorithm has begun; all further commands
(except Erase Suspend) are ignored until the erase operation is complete. If DQ3 is “0,” the device
accepts additional sector erase commands. To ensure the command has been accepted, the sys-
tem software should check the status of DQ3 prior to and following each sub-sequent sector erase
command. If DQ3 is high on the second status check, the last command might not have been
accepted.
Table 10.20
shows the status of DQ3 relative to the other status bits.
DQ1: W rite to Buffer Abort.
DQ1 indicates whether a Write to Buffer operation was aborted.
Under these conditions DQ1 produces a “1”. The system must issue the Write to Buffer Abort
Reset command sequence to return the device to reading array data. See Write Buffer Program-
ming Operation for more details.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S71WS512NC0BAWA63 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA70 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA72 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA73 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWE20 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS512NC0BAWA63 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA70 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA72 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWA73 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWAJ0 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。