參數(shù)資料
型號(hào)： S71PL129JC0BFI9P3
廠商： Spansion Inc.
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory
中文描述： 堆疊式多芯片產(chǎn)品（MCP）的快閃記憶體
文件頁數(shù)： 44/149頁
文件大小： 2693K
代理商： S71PL129JC0BFI9P3
44
S29PL129J for MCP
S29PL129J_MCP_00_A0 June 4, 2004
A d v a n c e I n f o r m a t i o n
43h
0031h
Major version number, ASCII (reflects modifications to the silicon)
44h
0033h
Minor version number, ASCII (reflects modifications to the CFI table)
45h
TBD
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Silicon Revision Number (Bits 7-2)
46h
0002h
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h
0001h
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h
0007h (PLxxxJ)
Sector Protect/Unprotect scheme
07 = Advanced Sector Protection
4Ah
00E7h (PL129J)
Simultaneous Operation
00 = Not Supported, X = Number of Sectors excluding Bank 1
4Bh
0000h
Burst Mode Type
00 = Not Supported, 01 = Supported
4Ch
0002h (PLxxxJ)
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
4Dh
0085h
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
4Eh
0095h
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
4Fh
0001h
Top/Bottom Boot Sector Flag
00h = Uniform device, 01h = Both top and bottom boot with write protect,
02h = Bottom Boot Device, 03h = Top Boot Device,
04h = Both Top and Bottom
50h
0001h
Program Suspend
0 = Not supported, 1 = Supported
57h
0004h
Bank Organization
00 = Data at 4Ah is zero, X = Number of Banks
58h
0027h (PL129J)
Bank 1 Region Information
X = Number of Sectors in Bank 1
59h
0060h (PL129J)
Bank 2 Region Information
X = Number of Sectors in Bank 2
5Ah
0060h (PL129J)
Bank 3 Region Information
X = Number of Sectors in Bank 3
5Bh
0027h (PL129J)
Bank 4 Region Information
X = Number of Sectors in Bank 4
Table 11. Primary Vendor-Specific Extended Query (Continued)
Addresses
Data
Description
相關(guān)PDF資料
PDF描述
S71WS-J Stacked Multi-Chip Product (MCP)
S71WS256PD0HF3SR3 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM
S71WS256PC0KF3SL2 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM
S71WS256PC0KF3SL3 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM
S71WS256PC0KF3SR0 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71PL129JC0BFI9U0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory
S71PL129JC0BFI9U2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory
S71PL129JC0BFI9U3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory
S71PL129JC0BFI9Z0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory
S71PL129JC0BFI9Z2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory
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