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參數(shù)資料
| 型號(hào)： | pentium III CPU |
| 廠商： | Intel Corp. |
| 英文描述： | Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器) |
| 中文描述： | 奔騰III處理器在450MHz至1.0GHz的（SC242工作頻率至450MHz到1GHz的奔三處理器的SC242） |
| 文件頁數(shù)： | 7/102頁 |
| 文件大?。?/td> | 920K |
| 代理商： | PENTIUM III CPU |
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Datasheet
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Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
Tables
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Processor Identification.......................................................................................11
Related Documents.............................................................................................12
Voltage Identification Definition...........................................................................19
System Bus Signal Groups .................................................................................21
Frequency Select Truth Table for BSEL[1:0].......................................................22
Absolute Maximum Ratings (CPUID 067xh).......................................................24
Absolute Maximum Ratings (CPUID 068xh).......................................................25
Voltage and Current Specifications.....................................................................26
AGTL+ Signal Groups DC Specifications............................................................29
Non-AGTL+ Signal Group DC Specifications
.....................................................29
AGTL+ Bus Specifications .................................................................................30
System Bus AC Specifications (Clock) at Processor Core Pins .........................31
Valid System Bus, Core Frequency, and Cache Bus Frequencies ....................32
System Bus AC Specifications (AGTL+ Signal Group) at the
Processor Core Pins ..........................................................................................32
System Bus AC Specifications (CMOS Signal Group) at
the Processor Core Pins ....................................................................................34
System Bus AC Specifications (Reset Conditions) ............................................34
System Bus AC Specifications (APIC Clock and APIC I/O)
at the Processor Core Pins ................................................................................34
System Bus AC Specifications (TAP Connection) at the
Processor Core Pins ..........................................................................................35
BCLK, PICCLK, and PWRGOOD Signal Quality
Specifications at the Processor Core .................................................................39
100 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance ....................43
133 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .....................44
33 MHz Non-AGTL+ Signal Group Overshoot/Undershoot Tolerance ...............44
Signal Ringback Specifications for Signal Simulation.........................................46
AGTL+ and Non-AGTL+ Signal Groups Ringback Tolerance Specifications .....46
Thermal Specifications for S.E.C.C. Packaged Processors ...............................49
Thermal Specifications for S.E.C.C.2 Packaged Processors..............................50
Thermal Diode Parameters.................................................................................52
Thermal Diode Interface......................................................................................52
Description Table for Processor Markings (S.E.C.C. Packaged Processor).......60
Description Table for Processor Markings (S.E.C.C.2 Packaged Processor).....66
S.E.C.C.2 Pressure Specifications......................................................................67
S.E.C.C. Materials...............................................................................................68
S.E.C.C.2 Materials.............................................................................................68
Signal Listing in Order by Pin Number................................................................69
Signal Listing in Order by Signal Name...............................................................73
Via Listing in Order by Signal Name ...................................................................78
Via Listing in Order by VIA Location....................................................................83
Boxed Processor Fan Heatsink Spatial Dimensions...........................................91
Fan Heatsink Power and Signal Specifications...................................................92
Baseboard Fan Power Connector Location ........................................................93
Signal Description ...............................................................................................94
Output Signals...................................................................................................101
Input Signals......................................................................................................101
Input/Output Signals (Single Driver)..................................................................102
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