參數(shù)資料
型號： pentium III CPU
廠商： Intel Corp.
英文描述： Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
中文描述： 奔騰III處理器在450MHz至1.0GHz的（SC242工作頻率至450MHz到1GHz的奔三處理器的SC242）
文件頁數(shù)： 5/102頁
文件大?。?/td> 920K
代理商： PENTIUM III CPU
Datasheet
5
Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
Figures
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Second Level (L2) Cache Implementation ...........................................................9
AGTL+ Bus Topology..........................................................................................14
Stop Clock State Machine...................................................................................14
BSEL[1:0] Example for a 100 MHz System Design
(100 MHz Processor Installed)............................................................................22
BSEL[1:0] Example for a 100/133 MHz Capable System
(100 MHz Processor Installed)............................................................................23
BSEL[1:0] Example for a 100/133 MHz Capable System
(133 MHz Processor Installed)............................................................................23
BCLK, PICCLK, and TCK Generic Clock Waveform...........................................36
System Bus Valid Delay Timings ........................................................................36
System Bus Setup and Hold Timings..................................................................37
System Bus Reset and Configuration Timings....................................................37
Power-On Reset and Configuration Timings.......................................................37
Test Timings (TAP Connection)..........................................................................38
Test Reset Timings .............................................................................................38
BCLK and PICCLK Generic Clock Waveform.....................................................39
Maximum Acceptable AGTL+ and Non-AGTL+
Overshoot/Undershoot Waveform.......................................................................45
Low to High AGTL+ and Non-AGTL+ Receiver Ringback Tolerance .................47
Signal Overshoot/Undershoot, Settling Limit, and Ringback 1............................47
S.E.C.Cartridge — 3-Dimensional View..............................................................48
S.E.C.Cartridge 2 — Substrate View ..................................................................49
Processor Functional Die Layout (CPUID 068xh)...............................................51
S.E.C.C. Packaged Processor — Multiple Views................................................53
S.E.C.C. Packaged Processor — Extended Thermal Plate
Side Dimensions .................................................................................................54
S.E.C.C. Packaged Processor — Bottom View Dimensions...............................54
S.E.C.C. Packaged Processor — Latch Arm, Extended
Thermal Plate Lug, and Cover Lug Dimensions..................................................55
S.E.C.C. Packaged Processor — Latch Arm, Extended
Thermal Plate, and Cover Detail Dimensions (Reference Dimensions Only) .....56
S.E.C.C. Packaged Processor — Extended Thermal Plate
Attachment Detail Dimensions ............................................................................57
S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment
Detail Dimensions, Continued.............................................................................58
S.E.C.C. Packaged Processor Substrate — Edge Finger Contact Dimensions .58
S.E.C.C. Packaged Processor Substrate — Edge Finger Contact
Dimensions, Detail A...........................................................................................59
Intel
Pentium III Processor Markings (S.E.C.C. Packaged Processor)...........59
S.E.C.C.2 Packaged Processor — Multiple Views..............................................60
S.E.C.C.2 Packaged Processor Assembly — Primary View...............................61
S.E.C.C.2 Packaged Processor Assembly — Cover View with Dimensions ......61
S.E.C.C.2 Packaged Processor Assembly — Heat Sink Attach Boss Section ...62
S.E.C.C.2 Packaged Processor Assembly — Side View....................................62
Detail View of Cover in the Vicinity of the Substrate Attach Features.................62
S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact Dimensions63
S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact
Dimensions (Detail A)..........................................................................................63
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