參數(shù)資料
型號: pentium III CPU
廠商: Intel Corp.
英文描述: Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
中文描述: 奔騰III處理器在450MHz至1.0GHz的(SC242工作頻率至450MHz到1GHz的奔三處理器的SC242)
文件頁數(shù): 49/102頁
文件大?。?/td> 920K
代理商: PENTIUM III CPU
Datasheet
49
Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
4.1
Thermal Specifications
Table 25
and
Table 26
provide the thermal design power dissipation and maximum and minimum
temperatures for Pentium
III
processors with S.E.C.C. and S.E.C.C.2 package technologies
respectively. While the processor core dissipates the majority of the thermal power, thermal power
dissipated by the L2 cache also impacts the overall processor power specification. This total
thermal power is referred to as processor power in the following specifications. Systems should
design for the highest possible processor power, even if a processor with a lower thermal
dissipation is planned.
NOTES:
1. These values are specified at nominal V
CCCORE
for the processor core and nominal V
CCL2
/V
CC3.3
for the L2
cache (if applicable).
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus
termination. The maximum power for each of these components does not occur simultaneously.
3. Extended Thermal Plate power is the processor power that is dissipated through the extended thermal plate.
Figure 19. S.E.C.Cartridge 2 — Substrate View
Substrate View
OLGA Package
L2 Cache
(CPUID 067xh Only
Table 25. Thermal Specifications for S.E.C.C. Packaged Processors
1
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(KBs)
Processor
Power
2
(W)
Extended
Thermal
Plate Power
3
(W)
Min
T
PLATE
Max
T
PLATE
Min
T
COVER
Max
T
COVER
450
512
25.3
25.5
5
70
5
75
500
512
28.0
28.2
5
70
5
75
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