參數(shù)資料
型號(hào)： pentium III CPU
廠商： Intel Corp.
英文描述： Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
中文描述： 奔騰III處理器在450MHz至1.0GHz的（SC242工作頻率至450MHz到1GHz的奔三處理器的SC242）
文件頁(yè)數(shù)： 10/102頁(yè)
文件大小： 920K
代理商： PENTIUM III CPU
10
Datasheet
Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
1.1
Terminology
In this document, a ‘#’ symbol after a signal name refers to an active low signal. This means that a
signal is in the active state (based on the name of the signal) when driven to a low level. For
example, when FLUSH# is low, a flush has been requested. When NMI is high, a nonmaskable
interrupt has occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as
address
or
data
), the ‘#’ symbol implies that the signal
is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers
to a hex ‘A’ (H= High logic level, L= Low logic level).
The term “system bus” refers to the interface between the processor, system core logic (a.k.a. the
AGPset components), and other bus agents. The system bus is a multiprocessing interface to
processors, memory, and I/O. The term “cache bus” refers to the interface between the processor
and the L2 cache components (TagRAM and BSRAMs). The cache bus does NOT connect to the
system bus, and is not visible to other agents on the system bus.
1.1.1
S.E.C.C.2 and S.E.C.C. Packaged Processor Terminology
The following terms are used often in this document and are explained here for clarification:
Pentium
III
processor
—The entire product including internal components, substrate, cover
and in S.E.C.C. packaged processors, an extended thermal plate.
S.E.C.C.
—The processor package technology called “Single Edge Contact Cartridge.”
S.E.C.C.2
—The follow-on to S.E.C.C. processor package technology. This differs from its
predecessor in that it has no extended thermal plate, thus reducing thermal resistance.
Processor substrate
—The FR4 board on which components are mounted inside the S.E.C.C.
or S.E.C.C.2 packaged processor (with or without components attached).
Processor core
—The processor’s execution engine.
Extended Thermal Plate
—This S.E.C.C. package feature is the surface used to attach a
heatsink or other thermal solution to the processor.
Cover
—The plastic casing that covers the backside of the substrate.
Latch arms
—An S.E.C.C. package feature which can be used as a means for securing the
processor in a retention mechanism.
OLGA
- Organic Land Grid Array. This package technology permits attaching the heatsink
directly to the die.
Additional terms referred to in this and other related documentation:
SC242
—The 242-contact slot connector (previously referred to as Slot 1 connector) that the
S.E.C.C. and S.E.C.C.2 plug into, just as the Pentium
Pro processor uses Socket 8.
Retention mechanism
—A mechanical piece which holds the S.E.C.C. or S.E.C.C.2 packaged
processor in the SC242 connector.
Heatsink support
—The support pieces that are mounted on the baseboard to provide added
support for heatsinks.
Keep-out zone
—The area on or near an S.E.C.C. or S.E.C.C.2 packaged processor substrate
that systems designs can not utilize.
Keep-in zone
—The area of the center of an S.E.C.C. or S.E.C.C.2 packaged processor
substrate that thermal solutions may utilize.
The L2 cache, TagRAM and BSRAM die, are industry designated names.
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