參數(shù)資料
型號: pentium III CPU
廠商: Intel Corp.
英文描述: Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
中文描述: 奔騰III處理器在450MHz至1.0GHz的(SC242工作頻率至450MHz到1GHz的奔三處理器的SC242)
文件頁數(shù): 66/102頁
文件大小: 920K
代理商: PENTIUM III CPU
66
Datasheet
Pentium
III Processor for the SC242 at 450 MHz to 1.0 GHz
5.3
S.E.C.C.2 Structural Mechanical Specification
The intention of the structural specification for S.E.C.C.2 is to ensure that the package will not be
exposed to excessive stresses that could adversely affect device reliability.
Figure 44
illustrates the
deflection specification for deflections away from the heatsink.
Figure 45
illustrates the deflection
specification in the direction of the heatsink.
The heatsink attach solution must not induce permanent stress into the S.E.C.C.2 substrate with the
exception of a uniform load to maintain the heatsink to the processor thermal interface.
Figure 46
and
Table 31
define the pressure specification.
Figure 43. Intel
Pentium
III Processor Markings (S.E.C.C.2 Package)
Table 30. Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)
Code Letter
Description
A
Logo
C
Trademark
D
Logo
F
Dynamic Mark Area – with 2-D matrix
NOTE:
Please refer to the Pentium
III
Processor Specification Update
for this information.
D
F
"""" " """ "" "
Figure 44. Substrate Deflection Away From Heat Sink
F/2
F/2
5 cycles maximum
0.025
Processor Substrate
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