參數(shù)資料
型號(hào): ISP1582BS
廠商: NXP SEMICONDUCTORS
元件分類: 總線控制器
英文描述: Hi-Speed Universal Serial Bus peripheral controller
中文描述: UNIVERSAL SERIAL BUS CONTROLLER, PQCC56
封裝: 8 X 8 MM, 0.85 MM PITCH, PLASTIC, MO-220, SOT-684-1, HVQFN-56
文件頁數(shù): 64/66頁
文件大?。?/td> 325K
代理商: ISP1582BS
Philips Semiconductors
ISP1582
Hi-Speed USB peripheral controller
Preliminary data
Rev. 03 — 25 August 2004
64 of 66
9397 750 13699
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
18. Revision history
Table 88:
Rev Date
03
Revision history
CPCN
2004xxxx
Description
Preliminary data (9397 750 13699)
Modifications:
Globally changed V
CC(I/O)
to the same value as V
CC
.
Table 2 “Pin description”
: updated pin description for EOT, DACK, DIOW and DIOR; also
removed table note 3.
Section 8.14.1 “Power-sharing mode”
: added Remark.
Section 9.5.4 “Scratch register (address: 78h)”
: updated the bus reset value.
Preliminary data (9397 750 12979)
Preliminary data (9397 750 11496)
-
02
01
20040629
20040223
-
-
相關(guān)PDF資料
PDF描述
ISP1583 Hi-Speed Universal Serial Bus peripheral controller
ISP1583BS Hi-Speed Universal Serial Bus peripheral controller
ISP1760BE Hi-Speed Universal Serial Bus host controller for embedded applications
ISP1760 Hi-Speed Universal Serial Bus host controller for embedded applications
ISP1761 Hi-Speed Universal Serial Bus On-The-Go controller
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