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| 型號： | ISP1581 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Universal Serial Bus 2.0 high-speed interface device |
| 中文描述： | 通用串行總線2.0高速接口設(shè)備 |
| 文件頁數(shù)： | 68/73頁 |
| 文件大小： | 1819K |
| 代理商： | ISP1581 |
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Philips Semiconductors
ISP1581
USB 2.0 HS interface device
Objective specification
Rev. 02 — 23 October 2000
68 of 73
9397 750 07648
Philips Electronics N.V. 2000. All rights reserved.
16. Soldering
16.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferable be kept below 220
°
C for thick/large
packages, and below 235
°
C small/thin packages.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1581BD | Universal Serial Bus 2.0 high-speed interface device |
| ISP1582 | Hi-Speed Universal Serial Bus peripheral controller |
| ISP1582BS | Hi-Speed Universal Serial Bus peripheral controller |
| ISP1583 | Hi-Speed Universal Serial Bus peripheral controller |
| ISP1583BS | Hi-Speed Universal Serial Bus peripheral controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1581BD | 功能描述:IC USB PERIPHERAL CTRLR 64-LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1581BD-S | 功能描述:IC USB CTRL HI-SPEED 64LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1581BD-T | 功能描述:IC USB CTRL HI-SPEED 64LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1582 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Hi-Speed Universal Serial Bus peripheral controller |
| ISP1582 PCI EVALKIT | 功能描述:PCI BUS EVAL KIT ISP1582 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標準包裝:1 系列:- 主要目的:電源管理，電池充電器 嵌入式:否 已用 IC / 零件:MAX8903A 主要屬性:1 芯鋰離子電池 次要屬性:狀態(tài) LED 已供物品:板 |
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