參數(shù)資料
型號(hào)： H5MS5162DFR-K3M
廠商： HYNIX SEMICONDUCTOR INC
元件分類： DRAM
英文描述： 32M X 16 DDR DRAM, 0.5 ns, PBGA60
封裝： 8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-60
文件頁(yè)數(shù)： 19/62頁(yè)
文件大小： 1314K
代理商： H5MS5162DFR-K3M
Rev 1.3 / Apr. 2009
26
11
Mobile DDR SDRAM 512Mbit (32M x 16bit)
H5MS5162DFR Series
Note:
1. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device
(i.e. this value can be greater than the minimum specification limits for tCL and tCH)
2. tQH = tHP - tQHS, where tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCL, tCH).
tQHS accounts for
1) the pulse duration distortion of on-chip clock circuits; and 2) the worst case push-out of DQS on one transition followed by the
worst case pull-in of DQ on the next transition, both of which are, separately, due to data pin skew and output pattern effects, and
p-channel to n-channel variation of the output drivers.
3. The only time that the clock frequency is allowed to change is during clock stop, power-down or self-refresh modes.
4. The transition time for DQ, DM and DQS inputs is measured between VIL(DC) to VIH(AC) for rising input signals, and VIH(DC) to
VIL(AC) for falling input signals.
5. DQS, DM and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times. Signal transitions
through the DC region must be monotonic.
6. Input slew rate ≥ 1.0 V/ns.
7. These parameters guarantee device timing but they are not necessarily tested on each device.
8. The transition time for address and command inputs is measured between VIH and VIL.
9. A CK/CK differential slew rate of 2.0 V/ns is assumed for this parameter.
10. tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a
specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
11. tDQSQ consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers for any
given cycle.
12. The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge. A valid
transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in
progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH,
LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
13. The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system
performance (bus turnaround) will degrade accordingly.
14. A low level on DQS may be maintained during High-Z states (DQS drivers disabled) by adding a weak pull-down element in the
system. It is recommended to turn off the weak pull-down element during read and write bursts (DQS drivers enabled).
15. Speed bin (CL-tRCD-tRP) = 3-3-3
16. Minimum 3CLK of tDAL(= tWR+tRP) is required because it need minimum 2CLK for tWR and minimum 1CLK for tRP.
tDAL = (tWR/tCK) + (tRP/tCK): for each of the terms above, if not already an integer, round to the next higher integer.
17. A maximum of eight Refresh commands can be posted to any given Low Power DDR SDRAM (Mobile DDR SDRAM), meaning that
the maximum absolute interval between any Refresh command and the next Refresh command is 8*tREFI.
18. All AC parameters are guaranteed by full range of operating voltage and temperature.
VDD, VDDQ = 1.7V ~ 1.95V. Temperature = -30oC ~ +85oC.
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H5MS5162DFR-L3M 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:512Mb (32Mx16bit) Mobile DDR SDRAM
H5MS5162EFR 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:536,870,912-bit CMOS Low Power Double Data Rate Synchronous DRAM (Mobile DDR SDRAM)
H5MS5162EFR-J3M 制造商:SK Hynix Inc 功能描述:SDRAM MOBILE DDR 512MB (X16) 60FBGA 制造商:SK Hynix Inc 功能描述:SDRAM, MOBILE DDR, 512MB (X16), 60FBGA 制造商:SK Hynix Inc 功能描述:SDRAM, MOBILE DDR, 512MB (X16), 60FBGA, Memory Type:DRAM - Synchronous, Memory C 制造商:SK Hynix Inc 功能描述:SDRAM, MOBILE DDR, 512MB (X16), 60FBGA, Memory Type:DRAM - Synchronous, Memory Configuration:32M x 16, Memory Case Style:FBGA, No. of Pins:60, IC Interface Type:LVCMOS, Operating Temperature Min:-30C, Operating Temperature Max:85C, , RoHS Compliant: Yes
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