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參數(shù)資料
| 型號： | DSP56321 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 24-Bit Digital Signal Processor |
| 中文描述： | 24位數(shù)字信號處理器 |
| 文件頁數(shù)： | 61/84頁 |
| 文件大?。?/td> | 898K |
| 代理商： | DSP56321 |
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DSP56321 Technical Data, Rev. 11
Freescale Semiconductor
4-1
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56321 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, T
J
, in
°
C can be obtained from this equation:
Equation 1:
T
J
T
A
P
D
R
θ
JA
+
=
Where:
T
A
R
θ
JA
P
D
=
=
=
ambient temperature °C
package junction-to-ambient thermal resistance °C/W
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
R
θ
JA
R
θ
JC
R
θ
CA
=
=
=
package junction-to-ambient thermal resistance °C/W
package junction-to-case thermal resistance °C/W
package case-to-ambient thermal resistance °C/W
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, R
θ
CA
. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from R
θ
JA
do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
×
(
)
R
θ
JA
R
θ
JC
R
θ
CA
+
=
相關PDF資料 |
PDF描述 |
|---|---|
| DSP56321VF200 | 24-Bit Digital Signal Processor |
| DSP56321VF220 | 24-Bit Digital Signal Processor |
| DSP56321VF240 | 24-Bit Digital Signal Processor |
| DSP56321VF275 | 24-Bit Digital Signal Processor |
| DSP56321VL200 | 24-Bit Digital Signal Processor |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| DSP56321EVM | 功能描述:開發(fā)板和工具包 - 其他處理器 DSP56321EVM RoHS:否 制造商:Freescale Semiconductor 產品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| DSP56321EVMUM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP56321 EVM User＇s Manual |
| DSP56321FC200 | 制造商:Freescale Semiconductor 功能描述:HIP7 56321 200MHZ DSP - Trays |
| DSP56321FC220 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| DSP56321RMAD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP56321 Reference Manual Addendum |
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