參數(shù)資料
型號(hào)： DSP56321
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
元件分類(lèi)： 數(shù)字信號(hào)處理
英文描述： 24-Bit Digital Signal Processor
中文描述： 24位數(shù)字信號(hào)處理器
文件頁(yè)數(shù)： 2/84頁(yè)
文件大?。?/td> 898K
代理商： DSP56321
DSP56321 Technical Data, Rev. 11
ii
Freescale Semiconductor
Table of Contents
Data Sheet Conventions.......................................................................................................................................ii
Features...............................................................................................................................................................iii
Target Applications.............................................................................................................................................iv
Product Documentation .......................................................................................................................................v
Chapter 1
Signals/Connections
1.1
Power ................................................................................................................................................................1-3
1.2
Ground ..............................................................................................................................................................1-3
1.3
Clock.................................................................................................................................................................1-3
1.4
External Memory Expansion Port (Port A) ......................................................................................................1-4
1.5
Interrupt and Mode Control..............................................................................................................................1-6
1.6
Host Interface (HI08)........................................................................................................................................1-7
1.7
Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-10
1.8
Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-11
1.9
Serial Communication Interface (SCI)...........................................................................................................1-12
1.10
Timers.............................................................................................................................................................1-13
1.11
JTAG and OnCE Interface ..............................................................................................................................1-14
Chapter 2
Specifications
2.1
2.2
2.3
2.4
Maximum Ratings.............................................................................................................................................2-1
Thermal Characteristics....................................................................................................................................2-2
DC Electrical Characteristics............................................................................................................................2-2
AC Electrical Characteristics............................................................................................................................2-3
Chapter 3
Packaging
3.1
3.2
Package Description .........................................................................................................................................3-2
MAP-BGA Package Mechanical Drawing.....................................................................................................3-10
Chapter 4
Design Considerations
4.1
Thermal Design Considerations........................................................................................................................4-1
4.2
Electrical Design Considerations......................................................................................................................4-2
4.3
Power Consumption Considerations.................................................................................................................4-3
4.4
Input (EXTAL) Jitter Requirements .................................................................................................................4-4
Appendix A
Power Consumption Benchmark
Data Sheet Conventions
OVERBAR
Indicates a signal that is active when pulled low (For example, the
RESET
pin is active when
low.)
Means that a high true (active high) signal is high or that a low true (active low) signal is low
Means that a high true (active high) signal is low or that a low true (active low) signal is high
“asserted”
“deasserted”
Examples:
Signal/Symbol
PIN
Logic State
Signal State
Asserted
Deasserted
Asserted
Deasserted
Voltage
V
IL
/V
OL
True
False
True
False
PIN
V
IH
/V
OH
PIN
V
IH
/V
OH
PIN
V
IL
/V
OL
Note:
Values for
V
IL
,
V
OL
,
V
IH
, and
V
OH
are defined by individual product specifications.
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