參數(shù)資料
型號(hào)： 935268625551
廠商： NXP SEMICONDUCTORS
元件分類： 總線控制器
英文描述： UNIVERSAL SERIAL BUS CONTROLLER, PQFP64
封裝： 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
文件頁數(shù)： 72/82頁
文件大小： 1965K
代理商： 935268625551
Philips Semiconductors
ISP1581
Hi-Speed USB interface device
Product data
Rev. 05 — 26 February 2003
74 of 78
9397 750 10766
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
18. Soldering
18.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne
pitch SMDs. In these situations reow soldering is recommended.
18.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 250
°C. The top-surface
temperature of the packages should preferably be kept:
below 220
°C for all the BGA packages and packages with a thickness ≥ 2.5mm
and packages with a thickness <2.5 mm and a volume
≥350 mm3 so called
thick/large packages
below 235
°C for packages with a thickness <2.5 mm and a volume <350 mm3 so
called small/thin packages.
18.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
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