參數(shù)資料
型號(hào)： V30MZ
英文描述： V30MZ(TM) Hardware (Preliminary) | User＇s Manual[01/2002]
中文描述： V30MZ（TM）硬件（初步）|用戶手冊(cè)[01/2002]
文件頁(yè)數(shù)： 9/89頁(yè)
文件大?。?/td> 418K
代理商： V30MZ
9
CONTENTS
CHAPTER 1 GENERAL DESCRIPTION ................................................................................................ 13
1.1 Features.........................................................................................................................................................13
1.2 Symbol Diagram ............................................................................................................................................13
1.3 Differences between V30MZ and V30HL, V30MX.........................................................................................14
CHAPTER 2 PIN FUNCTIONS................................................................................................................ 17
2.1 Pin List...........................................................................................................................................................17
2.2 Pin Statuses...................................................................................................................................................18
2.3 Description of Pin Statuses............................................................................................................................19
2.3.1 Normal pins.........................................................................................................................................19
2.3.2 Test Pins.............................................................................................................................................22
2.3.3 Reserved pins.....................................................................................................................................22
2.4 Handling of Unused Pins...............................................................................................................................23
CHAPTER 3 CPU FUNCTIONS.............................................................................................................. 25
3.1 Register Configuration...................................................................................................................................25
3.1.1 General-purpose registers (AW, BW, CW, DW) .................................................................................25
3.1.2 Segment registers (PS, SS, DS0, DS1)..............................................................................................25
3.1.3 Pointer (SP, BP)..................................................................................................................................25
3.1.4 Program counter (PC).........................................................................................................................26
3.1.5 Program status word (PSW) ...............................................................................................................26
3.1.6 Index register (IX, IY)..........................................................................................................................30
3.2 Address Space ..............................................................................................................................................31
3.2.1 Memory space ....................................................................................................................................31
3.2.2 I/O space.............................................................................................................................................32
3.3 Instruction Prefetch........................................................................................................................................33
3.4 Logical Address and Physical Address..........................................................................................................34
3.4.1 Segment system.................................................................................................................................34
3.4.2 Segment configuration........................................................................................................................35
3.4.3 Dynamic relocation .............................................................................................................................37
3.5 Effective Address...........................................................................................................................................39
3.6 Instruction Set................................................................................................................................................40
3.6.1 List of instruction sets by function.......................................................................................................40
3.6.2 Format of object code.........................................................................................................................41
3.7 Addressing Mode...........................................................................................................................................42
3.7.1 Instruction address .............................................................................................................................42
3.7.2 Data address.......................................................................................................................................43
CHAPTER 4 BUS CONTROL FUNCTIONS.......................................................................................... 47
4.1 Interface between V30MZ and Memory.........................................................................................................47
4.1.1 Cautions on accessing word data.......................................................................................................48
4.2 Interface between V30MZ and I/O.................................................................................................................49
4.3 Read/Write Timing of Memory and I/O ..........................................................................................................50
4.3.1 Read timing of memory and I/O..........................................................................................................50
4.3.2 Write timing of memory and I/O ..........................................................................................................52
4.4 Bus Hold Function .........................................................................................................................................54
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
V30N 制造商:Renesas Electronics Corporation 功能描述:
V-30TB 制造商:Mencom 功能描述:
V31 制造商:SMC Corporation of America 功能描述:CONNECTOR
V3-1 功能描述:基本/快動(dòng)開關(guān) 15.1A pin plunger Screw Terminals RoHS:否 制造商:Omron Electronics 觸點(diǎn)形式:SPDT 執(zhí)行器:Lever 電流額定值:5 A 電壓額定值 AC:250 V 電壓額定值 DC:30 V 功率額定值: 工作力:120 g IP 等級(jí):IP 67 NEMA 額定值: 端接類型:Wire 安裝:Panel
V3-1001 功能描述:基本/快動(dòng)開關(guān) Snap Action SPDT 10A 3.89N Thru-Hole RoHS:否 制造商:Omron Electronics 觸點(diǎn)形式:SPDT 執(zhí)行器:Lever 電流額定值:5 A 電壓額定值 AC:250 V 電壓額定值 DC:30 V 功率額定值: 工作力:120 g IP 等級(jí):IP 67 NEMA 額定值: 端接類型:Wire 安裝:Panel
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