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141
14 Electrical Characteristics
14.1 Absolute Maximum Ratings Over Free-Air Temperature Range
Supply voltage range, VDD (see Note 1)
–0.3 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI
–0.5 V to VDD+0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range at any output, VO
–0.5 V to VDD+0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation
See dissipation table
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
POWER RATING
TA < 25°C
DERATING FACTOR
ABOVE TA = 25°C
POWER RATING
TA = 70 °C
PGE
1.41 W
0.014 W/
°C
0.78 W
PGE
1.97 W
0.02 W/
°C
1.07 W
GGW
0.56 W
0.0056 W/
°C
0.31 W
GGW
0.68 W
0.0067 W/
°C
0.38 W
GHH
0.862 W
0.0107 W/
°C
0.377 W
GHH
1.283 W
0.016 W/
°C
0.561 W
Standard JEDEC low-K board
Standard JEDEC high-K board
14.2 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
Supply voltage, VCC
3
3.3
3.6
V
Output voltage, VO
TTL and LVCMOS terminals
V
PD, CONTEND, LINKON, PWRCLS[0:2]
0.7
×VDD
VDD
High-level input voltage, VIH
XRESETP
0.6
×VDD
VDD
V
High-level input voltage, VIH
Link inputs
0.7
×VDD
VDD
V
PD, CONTEND, LINKON, PWRCLS[0:2]
0
0.2
×VDD
Low-level input voltage, VIL
XRESETP
0
0.3
×VDD
V
Low-level input voltage, VIL
Link inputs
0
0.3
×VDD
V
PGE package (stress conditions, see Note 1)
0
25
70
GGW package (typical conditions, see Note 2)
0
25
65
Operating free-air temperature, TA
GGW package (stress conditions)
0
25
50
°C
Operating free-air temperature, TA
GGW industrial package (TSB43AA82I)
–40
25
85
C
GHH package
0
25
70
PGE, low K, RθJA = 70.82-°C/W, TA = 70°C
0
25
90.7
PGE, high K, RθJA = 50.78-°C/W, TA = 70°C
0
25
84.8
Virtual junction temperature, TJ
GGW, low K, RθJA = 177.83-°C/W, TA = 50°C
0
25
101.9
°C
Virtual junction temperature, TJ
GGW, high K, RθJA = 147.62-°C/W, TA = 50°C
0
25
93.1
°C
GHH, high K, RθJA = 92.71-°C/W, TA = 50°C
0
25
105
GHH, high K, RθJA = 62.352-°C/W, TA = 50°C
0
15
105
The junction temperatures listed reflect simulation conditions. The customer is responsible for verifying the junction temperature.
NOTES:
1. Stress conditions are VDD = 3.6 V, both 1394 ports running continuous data streams.
2. Typical conditions are VDD = 3.3 V, both 1394 ports receiving/transmitting data packets.