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參數資料
| 型號： | pentium II cpu |
| 廠商： | Intel Corp. |
| 英文描述： | Pentium II Processor AT 450MHZ(工作頻率450兆赫茲奔II處理器) |
| 中文描述： | 奔騰II處理器在450MHz（工作頻率450兆赫茲奔二處理器） |
| 文件頁數： | 9/84頁 |
| 文件大小： | 1092K |
| 代理商： | PENTIUM II CPU |
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Pentium
II Processor at 350 MHz, 400 MHz, and 450 MHz
Datasheet
9
Extended Thermal Plate
—This S.E.C.C. 100 MHz processor feature is the surface used to
attach a heatsink or other thermal solution to the processor. The extended thermal plate has an
extended skirt as compared to the 66 MHz Pentium II processors for increased thermal
capabilities.
Cover
—The plastic casing that covers the backsire of the substrate and holds processor
branding and marking information.
Latch arms
—An S.E.C.C. processor feature which can be used as a means for securing the
processor in the retention mechanism(s).
PLGA
- Plastic Land Grid Array. This package technology incorporates a heat slug within the
package that contacts the extended thermal plate.
OLGA
- Organic Land Grid Array. This package technology permits attaching the heatsink
directly to the die.
Additional terms referred to in this and other related documentation:
SC 242
—The 242-contact slot connector (previously referred to as Slot 1 connector) that the
S.E.C.C. and S.E.C.C.2 plug into, just as the Pentium
Pro processor uses Socket 8.
Retention mechanism
—An enabled mechanical piece which holds the S.E.C. cartridge in the
SC 242 connector.
Heatsink support
—The support pieces that are mounted on the motherboard to provide added
support for heatsinks.
The L2 cache (TagRAM, BSRAM) die keep industry names.
1.2
References
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
AP-485,
Intel Processor Identification and the CPUID Instruction
(Order Number 241618)
AP-827,
100 MHz GTL+ Layout Guidelines for the Pentium
II Processor and Intel
440BX
AGPset
(Order Number 243735)
AP-586,
Pentium
II Processor Thermal Design Guidelines
(Order Number 243331)
AP-587,
Pentium
II Processor Power Distribution Guidelines
(Order Number 243332)
AP-588,
Mechanical and Assembly Technology for S.E.C. Cartridge Processors
(Order
Number 243333)
AP-589,
Pentium
II Processor Electro-Magnetic Interference
(Order Number 243334)
Pentium
II Processor at 233, 266, 300, 333 MHz
(Order Number 243335)
Pentium
II Processor Specification Update
(Order Number 243337)
Slot 1 Connector Specification
(Order Number 243397)
Slot 1 Bus Terminator Card Design Guidelines
(Order Number 243409)
Intel Architecture Software Developer's Manual
(Order Number 243193)
—
Volume I: Basic Architecture
(Order Number 243190)
—
Volume II: Instruction Set Reference
(Order Number 243191)
相關PDF資料 |
PDF描述 |
|---|---|
| pentium II processor | 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器) |
| pentium II xeon processor | pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器) |
| Pentium III cpu with mobile | Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動模塊連接器2奔III處理器) |
| pentium III CPU | Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器) |
| pentium III processor | 32 bit Processor Mobile Module(32 位帶移動模塊處理器) |
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