參數(shù)資料
型號(hào)： pentium II cpu
廠商： Intel Corp.
英文描述： Pentium II Processor AT 450MHZ(工作頻率450兆赫茲奔II處理器)
中文描述： 奔騰II處理器在450MHz（工作頻率450兆赫茲奔二處理器）
文件頁(yè)數(shù)： 43/84頁(yè)
文件大?。?/td> 1092K
代理商： PENTIUM II CPU
Pentium
II Processor at 350 MHz, 400 MHz, and 450 MHz
Datasheet
43
4.1
Thermal Specifications
Table 27
and
Table 28
provide the thermal design power dissipation and maximum and minimum
temperatures for Pentium II processors with S.E.C.C. and S.E.C.C.2 package technologies,
respectively. While the processor core dissipates the majority of the thermal power, thermal power
dissipated by the L2 cache also impacts the overall processor power specification. Systems should
design for the highest possible thermal power, even if a processor with a lower thermal dissipation
is planned.
NOTES:
1. These values are specified at nominal V
CC
CORE
for the processor core and nominal V
CCL2
for the L2 cache.
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus termination.
The maximum power for each of these components does not occur simultaneously.
3. Extended Thermal Plate power is the processor power that is dissipated through the extended thermal plate.
4. These processors use the extended thermal plate for the Pentium
II processor (see
Figure 17
).
Table 28. Thermal Specifications for S.E.C.C.2 Packaged Processors
1
NOTES:
1. These values are specified at nominal V
CC
CORE
for the processor core and nominal V
CCL2
for the L2 cache.
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus termination.
The maximum power for each of these components does not occur simultaneously.
For S.E.C.C. packaged processors, the extended thermal plate is the attach location for all thermal
solutions. The maximum and minimum extended thermal plate temperatures are specified in
Table
27
. For S.E.C.C.2 packaged processors, thermal solutions attach to the processor by connecting
through the substrate to the cover. The maximum and minimum temperatures of the pertinent
locations are specified in
Table 28
. A thermal solution should be designed to ensure the
temperature of the specified locations never exceeds these temperatures.
The total processor power is a result of heat dissipation that is a combination of heat from both the
processor core and L2 cache. The overall system chassis thermal design must comprehend the
entire processor power. In S.E.C.C. packaged processors, the extended thermal plate power is a
component of this power, and is composed of a combination of the processor core and the L2 cache
dissipating heat through the extended thermal plate. The heatsink need only be designed to
dissipate the extended thermal plate power. See
Table 27
for current Pentium II processor thermal
design specifications.
Table 27. Thermal Specifications for S.E.C.C. Packaged Processors
1
Processor Core
Frequency
(MHz)
L2 Cache
Size
(Kbytes)
Processor
Power
(W)
Extended
Thermal Plate
Power
(W)
Min
T
PLATE
(°C)
Max
T
PLATE
(°C)
Min
T
COVER
(°C)
Max
T
COVER
(°C)
450
4
400
4
350
4
512
27.1
26.4
5
70
5
75
512
24.3
23.6
5
75
5
75
512
21.5
20.8
5
75
5
75
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(Kbytes)
Processor
Power
(W)
Min
PLGA
T
CASE
(°C)
Max
PLGA
T
CASE
(°C)
Min
OLGA
T
JUNC
(°C)
Max
OLGA
T
JUNC
(°C)
L2 Cache
Min T
CASE
(°C)
L2 Cache
Max T
CASE
(°C)
Min
T
COVER
(°C)
Max
T
COVER
(°C)
450
512
27.1
N/A
N/A
5
90
5
105
5
75
400
512
24.3
N/A
N/A
5
90
5
105
5
75
350
512
21.5
5
80
N/A
N/A
5
105
5
75
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