- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369993 > pentium II cpu (Intel Corp.) Pentium II Processor AT 450MHZ(工作頻率450兆赫茲奔II處理器) PDF資料下載
參數(shù)資料
| 型號： | pentium II cpu |
| 廠商： | Intel Corp. |
| 英文描述： | Pentium II Processor AT 450MHZ(工作頻率450兆赫茲奔II處理器) |
| 中文描述： | 奔騰II處理器在450MHz（工作頻率450兆赫茲奔二處理器） |
| 文件頁數(shù)： | 5/84頁 |
| 文件大?。?/td> | 1092K |
| 代理商： | PENTIUM II CPU |
第1頁第2頁第3頁第4頁當(dāng)前第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁
Datasheet
5
Pentium
II
Processor at 350 MHz, 400 MHz, and 450 MHz
24
Pentium
II Processor (S.E.C.C. Package)—Extended Thermal Plate
Attachment Detail Dimensions, Continued..........................................................50
Pentium
II Processor Substrate (S.E.C.C. Package)—Edge Finger
Contact Dimensions ............................................................................................50
Pentium
II Processor Substrate (S.E.C.C. Package)—Edge Finger
Contact Dimensions, Detail A..............................................................................51
Pentium
II Processor Markings (S.E.C.C. Package).........................................51
Pentium
II Processor (S.E.C.C.2 Package) Top and Side Views—
OLGA Processor Core ........................................................................................52
Pentium
II Processor (S.E.C.C.2 Package) Top and Side Views—
PLGA Processor Core.........................................................................................53
Pentium
II Processor Assembly (S.E.C.C.2 Package)—Primary View .............53
Pentium
II Processor Assembly (S.E.C.C.2 Package)—Cover View with
Dimensions..........................................................................................................54
Pentium
II Processor Assembly (S.E.C.C.2 Package)—Heat Sink Attach
Boss Section .......................................................................................................54
Pentium
II Processor Assembly (S.E.C.C.2 Package), Side View—
OLGA Substrate Shown......................................................................................55
Detail View of Cover in the Vicinity of the Substrate Attach Features.................55
Pentium
II Processor Substrate (S.E.C.C.2 Package), Edge Finger Contact
Dimensions..........................................................................................................56
Pentium
II Processor Markings (S.E.C.C.2 Package).......................................56
Boxed Pentium
II Processor in the S.E.C.C. Packaging Installed in Retention
Mechanism (Fan Power Cable Not Shown) .......................................................65
Boxed Pentium
II Processor in the S.E.C.C.2 Packaging (Fan Power Cable
Not Shown).........................................................................................................65
Side View Space Requirements for the Boxed Processor with S.E.C.C.
Packaging............................................................................................................66
Front View Space Requirements for the Boxed Processor with S.E.C.C.
Packaging............................................................................................................67
Side View Space Requirements for the Boxed Processor with S.E.C.C.2
Packaging............................................................................................................67
Front View Space Requirements for the Boxed Processor with S.E.C.C.2
Packaging............................................................................................................68
Top View Air Space Requirements for the Boxed Processor..............................68
Heatsink Support Hole Locations and Size.........................................................70
Side View Space Requirements for Boxed Processor Fan Heatsink Supports...71
Top View Space Requirements for Boxed Processor Fan Heatsink Supports ...71
Boxed Processor Fan Heatsink Power Cable Connector Description.................72
Recommended Motherboard Power Header Placement Relative to Fan Power
Connector and Pentium
II Processor ................................................................73
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
Tables
1
2
3
4
5
6
Voltage Identification Definition...........................................................................16
Recommended Pull-up Resistor Values (Approximate) for CMOS Signals ........18
System Bus Signal Groups .................................................................................19
Absolute Maximum Ratings.................................................................................21
Voltage and Current Specifications ....................................................................22
AGTL+ Signal Groups DC Specifications ...........................................................24
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| pentium II processor | 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器) |
| pentium II xeon processor | pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器) |
| Pentium III cpu with mobile | Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器) |
| pentium III CPU | Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器) |
| pentium III processor | 32 bit Processor Mobile Module(32 位帶移動(dòng)模塊處理器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P-ENV568K3G3 | 制造商:Panasonic Industrial Company 功能描述:TUNER |
| PEO14012 | 制造商:TE Connectivity 功能描述:RELAY SPCO 12VDC |
| PEO14024 | 制造商:TE Connectivity 功能描述:RELAY SPCO 24VDC |
| PEO96742 | 制造商:Delphi Corporation 功能描述:ASM TERM |
| PEOODO3A | 制造商:MACOM 制造商全稱:Tyco Electronics 功能描述:Versatile Power Entry Module with Small Footprint |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。