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參數(shù)資料
| 型號： | ISP1583 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Hi-Speed Universal Serial Bus peripheral controller |
| 中文描述： | 高速通用串行總線外設(shè)控制器 |
| 文件頁數(shù)： | 82/87頁 |
| 文件大?。?/td> | 420K |
| 代理商： | ISP1583 |
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Philips Semiconductors
ISP1583
Hi-Speed USB peripheral controller
Product data
Rev. 03 — 12 July 2004
82 of 87
9397 750 13461
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended. In these situations
reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1583BS | Hi-Speed Universal Serial Bus peripheral controller |
| ISP1760BE | Hi-Speed Universal Serial Bus host controller for embedded applications |
| ISP1760 | Hi-Speed Universal Serial Bus host controller for embedded applications |
| ISP1761 | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP1761BE | Hi-Speed Universal Serial Bus On-The-Go controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1583BS | 功能描述:IC USB CTRL HI-SPEED 64HVQFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1583BS,518 | 功能描述:USB 接口集成電路 USB PERIPH CNTRLR RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1583BS,551 | 功能描述:USB 接口集成電路 HI-SPEED USB2 DEVICE RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1583BS,557 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1583BS518 | 制造商:ST-Ericsson 功能描述:CONTROLLER USB PERIPHERAL 64HVQFN |
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