參數(shù)資料
型號(hào): IBM25PPC970MP7TR21AFT
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 1600 MHz, RISC PROCESSOR, CBGA575
封裝: 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-575
文件頁(yè)數(shù): 42/74頁(yè)
文件大?。?/td> 845K
代理商: IBM25PPC970MP7TR21AFT
Datasheet
PowerPC 970MP RISC Microprocessor
Version 1.3
January 17, 2008
Dimensions and Physical Signal Assignments
Page 47 of 74
Figure 4-1. PowerPC 970MP Mechanical Package (Side and Top View) (Preliminary)
Legend
DATUM A is the center plane of the feature labeled DATUM A.
DATUM B is the center plane of the feature labeled DATUM B.
3
Unless otherwise specified, the part is symmetrical about the center lines defined by DATUMs A and B.
4
Where not otherwise defined, the center lines indicated are to be interpreted as a datum framework, established by
DATUM D, A, and B respectively.
This line defines the approximate boundary configuration of encapsulant as dispensed.
10
The chip’s assembled height (which includes silicon thickness and melted C4) for 300 mm wafers is: 0.829 - 0.908 mm.
The 300 mm silicon thickness is 0.785
±0.020 mm.
1
2
9
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