參數(shù)資料
型號(hào)： IBM25PPC970MP7TR21AFT
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 1600 MHz, RISC PROCESSOR, CBGA575
封裝： 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-575
文件頁數(shù)： 25/74頁
文件大?。?/td> 845K
代理商： IBM25PPC970MP7TR21AFT
Datasheet
PowerPC 970MP RISC Microprocessor
Version 1.3
January 17, 2008
Electrical and Thermal Characteristics
Page 31 of 74
3.5.1.3 Module-to-Module Interconnect Characteristics
All traces are to be routed as striplines or as microstrips. The tolerance on trace impedance is 10%. Care
must be taken when mixing transmission line styles to manage propagation delay differences. The clock
delay should be longer than the longest data delay for bus speeds at or above 1.1 Gbps or on lines above
13 cm.
Figure 3-4. Typical Implementation for a Single-Ended Line
Table 3-10. Processor Interconnect SSB Driver Specifications
Symbol
Description
Minimum
Typical
Maximum
Units
Notes
VOHdc
High output level at dc
—
0.87 OVDD
—mV
VOLdc
Low output level at dc
—
0.13 OVDD
—mV
TDR
Driver rise time
70
133
171
ps
20% to 80% of swing
TDF
Driver fall time
81
155
162
ps
20% to 80% of swing
ZD
Driver output impedance
15
20
25
Ω
Low-
Ω mode
ZD
Driver output impedance
30
40
50
Ω
High-
Ω mode
Table 3-11. Processor Interconnect SSB Printed Circuit Board Trace Specifications
Symbol
Description
Minimum
Typical
Maximum
Units
Notes
LSSB
Trace length
—
18
cm
For transfer speeds of
1.5 Gbps
22.5
cm
For transfer speeds of
1.0 Gbps
Z0
Trace impedance
45
50
55
Ω
SPCB
Printed circuit board (PCB) data
trace skew
—
150
ps
OVDD
Zd
Z0
Zd
OVDD
TR0
VREF-SSB
LSSB
R
TR0
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相關(guān)代理商/技術(shù)參數(shù)
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IBM25PPC970MP7TR23AET 制造商:IBM 功能描述:ANTARES MP DD1.1X 1.8GHZ PERFORMANCE OPTIMIZED - Trays
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IBM25PPC970MP7TR50AET 制造商:IBM 功能描述:ANTARES MP DD1.1X 1.2GHZ POWER OPTIMIZED - Trays
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