
Spartan-3 FPGA Family: Introduction and Ordering Information
DS099-1 (v1.4) January 17, 2005
Preliminary Product Specification
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Ordering Information
Spartan-3 FPGAs are available in both standard and Pb-free packaging options for all device/package combinations. The
Pb-free packages include a special ’G’ character in the ordering code.
Standard Packaging
Pb-Free Packaging
For additional information on Pb-free packaging, see
XAPP427
: "Implementation and Solder Reflow Guidelines for Pb-Free
Packages"
.
Notes:
1. The -5 speed grade is exclusively available in the Commercial temperature range.
XC3S50 -4 PQ 208 C
Device Type
Speed Grade
Temperature Range:
C = Commercial (T
= 0
C to 85
C)
I = Industrial (T
J
= -40
C to 100
C)
Package Type
Number of Pins
Example:
DS099-1_02a_071304
Device
Speed Grade
Package Type / Number of Pins
Temperature Range (T
J
)
C Commercial (0°C to 85°C)
XC3S50
-4 Standard Performance
-5 High Performance
1
VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)
XC3S200
CP(G)132 132-pin Chip-Scale Package (CSP)
I
Industrial (–40°C to 100°C)
XC3S400
TQ(G)144 144-pin Thin Quad Flat Pack (TQFP)
XC3S1000
PQ(G)208 208-pin Plastic Quad Flat Pack (PQFP)
XC3S1500
FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
XC3S2000
FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA)
XC3S4000
FG(G)456 456-ball Fine-Pitch Ball Grid Array (FBGA)
XC3S5000
FG(G)676 676-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)900 900-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)1156 1156-ball Fine-Pitch Ball Grid Array (FBGA)
XC3S50 -4 PQ G 208 C
Device Type
Speed Grade
Temperature Range:
C = Commercial (T
= 0
C to 85
C)
I = Industrial (T
J
= -40
C to 100
C)
Number of Pins
Pb-free
Package Type
Example:
DS099-1_02b_071304