
Spartan-3 FPGA Family: Pinout Descriptions
22
www.xilinx.com
DS099-4 (v1.6) January 17, 2005
Product Specification
R
Selecting the Right Package Option
Spartan-3 FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
packages are superior in almost every other aspect, as
summarized in
Table 13
. Consequently, Xilinx recommends
using BGA packaging whenever possible.
Mechanical Drawings
Detailed mechanical drawings for each package type are
available from the Xilinx website at the specified location in
Table 14
.
Table 13:
Comparing Spartan-3 Packaging Options
Characteristic
Quad Flat-Pack (QFP)
Ball Grid Array (BGA)
Maximum User I/O
141
784
Packing Density (Logic/Area)
Good
Better
Signal Integrity
Fair
Better
Simultaneous Switching Output (SSO) Support
Limited
Better
Thermal Dissipation
Fair
Better
Minimum Printed Circuit Board (PCB) Layers
4
6
Hand Assembly/Rework
Possible
Very Difficult
Table 14:
Xilinx Package Mechanical Drawings
Package
Web Link (URL)
VQ100 / VQG100
http://www.xilinx.com/bvdocs/packages/vq100.pdf
CP132/ CPG132
http://www.xilinx.com/bvdocs/packages/cp132.pdf
TQ144 / TQG144
http://www.xilinx.com/bvdocs/packages/tq144.pdf
PQ208 / PQG208
http://www.xilinx.com/bvdocs/packages/pq208.pdf
FT256 / FTG256
http://www.xilinx.com/bvdocs/packages/ft256.pdf
FG320 / FGG320
http://www.xilinx.com/bvdocs/packages/fg320.pdf
FG456 / FGG456
http://www.xilinx.com/bvdocs/packages/fg456.pdf
FG676 / FGG676
http://www.xilinx.com/bvdocs/packages/fg676.pdf
FG900 /FGG900
http://www.xilinx.com/bvdocs/packages/fg900.pdf
FG1156 / FGG1156
http://www.xilinx.com/bvdocs/packages/fg1156.pdf