參數(shù)資料
型號： SAA8200HL
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： Ensation Base integrated wireless audio baseband
中文描述： SPECIALTY CONSUMER CIRCUIT, PQFP100
封裝： 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-407-1, LQFP-100
文件頁數(shù)： 68/71頁
文件大小： 298K
代理商： SAA8200HL
SAA8200HL_2
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 02 — 17 October 2005
68 of 71
Philips Semiconductors
SAA8200HL
Ensation Base integrated wireless audio baseband
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Additional soldering information
15.1 Lead-free solder
Lead-free solder can be used for soldering the TEA7000.
15.2 MSL level
MSL level:
<tbd>
16. Revision history
Table 35:
Document ID
SAA8200HL_2
Modifications:
Revision history
Release date
20051017
Audio ADC supply voltages added (
Table 25
).
Audio DAC R
L
value revised; V
HP_COM
value corrected; V
ADC_COM
value added (
Table 28
).
Dynamic audio characteristics revised (
Table 29
).
20041217
Objective data sheet
-
Data sheet status
Preliminary data sheet
Change notice
-
Doc. number
-
Supersedes
SAA8200HL_1
SAA8200HL_1
9397 750 13236
-
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