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參數(shù)資料
| 型號： | SAA8200HL |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | Ensation Base integrated wireless audio baseband |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封裝： | 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-407-1, LQFP-100 |
| 文件頁數(shù)： | 67/71頁 |
| 文件大?。?/td> | 298K |
| 代理商： | SAA8200HL |
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SAA8200HL_2
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 02 — 17 October 2005
67 of 71
Philips Semiconductors
SAA8200HL
Ensation Base integrated wireless audio baseband
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
14.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
Table 34:
Package
[1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5] [6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
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相關(guān)代理商/技術(shù)參數(shù) |
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| SAA8200HL/N100,518 | 制造商:ST-Ericsson 功能描述:SAA8200HL Series Ensation Base Integrated Wireless Audio Baseband - LQFP-100 |
| SAA8510EV1UM | 制造商:STMicroelectronics 功能描述: |
| SA-A870-FREQ | 制造商:NEL 制造商全稱:Nel Frequency Controls,inc 功能描述:Positive ECL (PECL) |
| SA-A871-FREQ | 制造商:NEL 制造商全稱:Nel Frequency Controls,inc 功能描述:Positive ECL (PECL) |
| SA-A877-FREQ | 制造商:NEL 制造商全稱:Nel Frequency Controls,inc 功能描述:Positive ECL (PECL) |
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