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參數(shù)資料
| 型號： | SAA8200HL |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | Ensation Base integrated wireless audio baseband |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封裝： | 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-407-1, LQFP-100 |
| 文件頁數(shù)： | 66/71頁 |
| 文件大?。?/td> | 298K |
| 代理商： | SAA8200HL |
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SAA8200HL_2
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 02 — 17 October 2005
66 of 71
Philips Semiconductors
SAA8200HL
Ensation Base integrated wireless audio baseband
13. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
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