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| 型號： | Pentium III cpu with mobile |
| 廠商： | Intel Corp. |
| 英文描述： | Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器) |
| 中文描述： | 奔騰III處理器的移動(dòng)模塊連接器2（絲裂霉素2）（帶移動(dòng)模塊連接器2奔三處理器） |
| 文件頁數(shù)： | 61/64頁 |
| 文件大小： | 773K |
| 代理商： | PENTIUM III CPU WITH MOBILE |
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Pentium
III Processor Mobile Module MMC-2
245304-003
Datasheet
55
7.0
Thermal Specification
7.1
Thermal Design Power
The power handling capability of the system thermal solution may be reduced to less than the
recommended typical Thermal Design Power (TDP) as shown in
Table 27
with the implementation
of firmware/software control or "throttling
”
that reduces the CPU power consumption and
dissipation. The typical TDP is the typical power dissipation under normal operating conditions at
nominal V_CORE (CPU power supply) while executing the worst case power instruction mix. This
includes the power dissipated by all of the relevant components. During all operating
environments, the processor junction temperature, TJ, must be within the specified range of 0
°
C to
100
°
C.
Table 27. Thermal Design Power Specification
NOTES:
1. During all operating environments, the processor temperature, T
j
, must be within the special range of 0
°
C to
100
°
C.
2. TDP
Module
is a thermal-solution design reference point for thermal solution readiness for total module power.
Symbol
Parameter
Typical
450 MHz
Typical
500 MHz
Notes
TDP
Module
Module Thermal Design Power
14.1W
15.0W
Module = core + 82443BX +
voltage regulator
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