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參數(shù)資料
| 型號(hào)： | Pentium II 333 |
| 廠商： | Intel Corp. |
| 英文描述： | Processor with On-Die Cache Low-Power Module(帶片上緩存低能量模塊的處理器) |
| 中文描述： | 而對(duì)整個(gè)處理器模高速緩存低功率模塊（帶片上緩存低能量模塊的處理器） |
| 文件頁數(shù)： | 48/50頁 |
| 文件大?。?/td> | 1123K |
| 代理商： | PENTIUM II 333 |
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Pentium
II
Processor with On-Die Cache – Low-Power Module
48
Datasheet
6.0
Thermal Specification
6.1
Thermal Design Power
The power handling capability of the system thermal solution may be reduced to less than the
recommended typical thermal design power (TDP) with the implementation of firmware/software
control or “throttling,” which reduces the processor power consumption and dissipation. The
typical TDP is the typical power dissipation under normal operating conditions at nominal
V_CORE (CPU power supply) while executing the worst case power instruction mix. This
includes the power dissipated by
all
of the relevant components.
During all operating environments, the processor junction temperature, T
J
, must be within the
specified range of 0° C to 100° C.
6.2
Thermal Sensor Setpoint
The thermal sensor implements the SMBALERT# signal described in the SMBus specification.
SMBALERT# is always asserted when the temperature of the processor core thermal diode or the
thermal sensor internal temperature exceeds either the upper or lower temperature thresholds.
SMBALERT# may also be asserted if the measured temperature equals either the upper or the
lower threshold.
Table 27. Thermal Design Power Specification
Symbol
Parameter
Typical
Notes
TDP
module
Module Thermal Design Power
11.5 W
Module TDP = core, 82443BX, and voltage
regulator
NOTES:
1.
During all operating environments, the processor temperature, T
J
must be within the specified range of 0° C to 100° C.
2.
TDP
module
is a thermal solution design reference point for OEM thermal solution readiness for total module power.
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