- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369993 > Pentium II 333 (Intel Corp.) Processor with On-Die Cache Low-Power Module(帶片上緩存低能量模塊的處理器) PDF資料下載
參數(shù)資料
| 型號(hào)： | Pentium II 333 |
| 廠商： | Intel Corp. |
| 英文描述： | Processor with On-Die Cache Low-Power Module(帶片上緩存低能量模塊的處理器) |
| 中文描述： | 而對(duì)整個(gè)處理器模高速緩存低功率模塊（帶片上緩存低能量模塊的處理器） |
| 文件頁(yè)數(shù)： | 44/50頁(yè) |
| 文件大小： | 1123K |
| 代理商： | PENTIUM II 333 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)當(dāng)前第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)
Pentium
II
Processor with On-Die Cache – Low-Power Module
44
Datasheet
5.1.2
Printed Circuit Board Thickness
Figure 12 shows the minimum and maximum thickness of the printed circuit board (PCB). The
range of PCB thickness allows for different PCB technologies to be used with current and future
modules.
Note:
The system manufacturer must ensure that the mechanical restraining method and/or system-level
EMI contacts are able to support this range of PCB for compatibility with future modules.
5.1.3
Height Restrictions
Figure 13 shows the mechanical stack-up and associated component clearance requirements. This
is the module keep-out zone and should not be entered. The system manufacturer establishes
board-to-board clearance between the module and the system electronics by selecting one of three
mating connectors. The connector sizes available are 4 millimeters, 6 millimeters, and
8 millimeters. The three sizes provide flexibility in choosing the system electronics components
between the two boards. Information on these connectors can be obtained from Berg Electronics
(part number 74291-002).
Figure 12. Printed Circuit Board Thickness
min: 0.90mm
max: 1.10mm
Processor Module
printed circuit board
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| pentium II cpu with mobile | pentium II processor With On-die Cache Mobile Module Connector 2 (MMC-2)(帶緩存和連接器2的奔II處理器) |
| pentium II cpu | Pentium II Processor AT 450MHZ(工作頻率450兆赫茲奔II處理器) |
| pentium II processor | 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器) |
| pentium II xeon processor | pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器) |
| Pentium III cpu with mobile | Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P-ENV568K3G3 | 制造商:Panasonic Industrial Company 功能描述:TUNER |
| PEO14012 | 制造商:TE Connectivity 功能描述:RELAY SPCO 12VDC |
| PEO14024 | 制造商:TE Connectivity 功能描述:RELAY SPCO 24VDC |
| PEO96742 | 制造商:Delphi Corporation 功能描述:ASM TERM |
| PEOODO3A | 制造商:MACOM 制造商全稱:Tyco Electronics 功能描述:Versatile Power Entry Module with Small Footprint |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。