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參數(shù)資料
| 型號： | Pentium II 333 |
| 廠商： | Intel Corp. |
| 英文描述： | Processor with On-Die Cache Low-Power Module(帶片上緩存低能量模塊的處理器) |
| 中文描述： | 而對整個處理器模高速緩存低功率模塊（帶片上緩存低能量模塊的處理器） |
| 文件頁數(shù)： | 47/50頁 |
| 文件大?。?/td> | 1123K |
| 代理商： | PENTIUM II 333 |
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Pentium
II
Processor with On-Die Cache – Low-Power Module
Datasheet
47
5.3
Module Physical Support
5.3.1
Module Mounting Requirements
Three mounting holes are available for securing the module to the system base. See Figure 10 for
mounting hole locations. These hole locations and board edge clearances will remain fixed for all
modules. All three mounting holes should be used to ensure long term mechanical reliability and
EMI integrity of the system. The board edge clearance includes a 0.762-mm (0.030 inches) wide
EMI containment ring around the perimeter of the module. This ring is on each layer of the module
PCB and is grounded. On the surface of the module, the metal is exposed for EMI shielding
purposes. The hole patterns also have a plated surrounding ring to use a metal standoff for EMI
shielding purposes.
Standoffs should be used to provide support for the installed module. The distance from the bottom
of the module PCB to the top of the system electronics board with the connectors mated is 4.0
millimeters + 0.16 mm / -0.13 mm. However, the warpage of the baseboard can vary and should be
calculated into the final dimensions of the standoffs used.
Figure 16 shows the standoff support hole patterns, the board edge clearance, and the dimensions
of the EMI containment ring. No components are placed on the board in the keep-out area.
5.3.2
Module Weight
The module weighs approximately 50 g.
Figure 16. Standoff Holes, Board Edge Clearance, and EMI Containment Ring
Hole detail, 3 places
0.762 mm width of EMI containment ring
1.27+/- 0.19 mm board edge to EMI ring
2.54+/-0.19 mm keep-out area
3.81+/-0.19 mm board edge to hole centerline
3.81+/-0.19 mm
4.45 mm diameter grounded ring
+ 0.050 mm
- 0.025 mm
hole diameter
2.413 mm
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