參數(shù)資料
型號(hào)： Pentium II 333
廠商： Intel Corp.
英文描述： Processor with On-Die Cache Low-Power Module(帶片上緩存低能量模塊的處理器)
中文描述： 而對(duì)整個(gè)處理器模高速緩存低功率模塊（帶片上緩存低能量模塊的處理器）
文件頁(yè)數(shù)： 4/50頁(yè)
文件大小： 1123K
代理商： PENTIUM II 333
Pentium
II
Processor with On-Die Cache – Low-Power Module
4
Datasheet
4.7.3
4.7.4
Power Planes: Bulk Capacitance Requirements....................................35
Surge Current Guidelines.......................................................................36
4.7.4.1 Slew-rate Control: Circuit Description .......................................38
4.7.4.2 Undervoltage Lockout: Circuit Description (V_uv_lockout).......40
4.7.4.3 Overvoltage Lockout: Circuit Description (V_ov_lockout).........40
4.7.4.4 Overcurrent Protection: Circuit Description...............................40
Active Thermal Feedback ...................................................................................41
Thermal Sensor Configuration Register..............................................................41
Mechanical Specification
......................................................................................42
5.1
Module Dimensions.............................................................................................42
5.1.1
Pin 1 Location of the 400-pin Connector................................................43
5.1.2
Printed Circuit Board Thickness.............................................................44
5.1.3
Height Restrictions.................................................................................44
5.2
Thermal Transfer Plate .......................................................................................45
5.3
Module Physical Support ....................................................................................47
5.3.1
Module Mounting Requirements ............................................................47
5.3.2
Module Weight .......................................................................................47
Thermal Specification
............................................................................................48
6.1
Thermal Design Power........................................................................................48
6.2
Thermal Sensor Setpoint ....................................................................................48
Labeling Information
...............................................................................................49
Environmental Standards
.....................................................................................50
4.8
4.9
5.0
6.0
7.0
8.0
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Block Diagram of the Low-Power Module.............................................................8
400-Pin Connector Footprint Pad Numbers........................................................21
Clock Control States ...........................................................................................25
BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Core Pins......31
Power-on Sequence Timing................................................................................35
Instantaneous In-rush Current Model..................................................................36
Instantaneous In-rush Current SPICE Simulation...............................................37
Overcurrent Protection Circuit.............................................................................38
Spice Simulation Using In-rush Protection (Example ONLY)) ............................39
Board Dimensions with 400-Pin Connector Orientation......................................42
Board Dimensions with 400-Pin Connector- Pin 1 Orientation ...........................43
Printed Circuit Board Thickness..........................................................................44
Keep-out Zone ....................................................................................................45
Thermal Transfer Plate (A)..................................................................................46
Thermal Transfer Plate (B)..................................................................................46
Standoff Holes, Board Edge Clearance, and EMI Containment Ring.................47
Product Tracking Information..............................................................................49
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