參數(shù)資料
型號(hào)： MSC8102M4000
廠商： MOTOROLA INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 32-BIT, 75 MHz, OTHER DSP, CBGA431
封裝： 20 X 20 MM, FLIP CHIP, CERAMIC, BGA-431
文件頁(yè)數(shù)： 88/96頁(yè)
文件大小： 1557K
代理商： MSC8102M4000
4-1
Chapter 4
Design
Considerations
4.1 Thermal Design Considerations
An estimation of the chip-junction temperature, TJ, in °C can be obtained from the following:
Equation 1: TJ = TA + (RθJA × PD)
where
TA = ambient temperature near the package (°C)
R
θJA = junction-to-ambient thermal resistance (°C/W)
PD = PINT + PI/O = power dissipation in the package (W)
PINT = IDD × VDD = internal power dissipation (W)
PI/O = power dissipated from device on output pins (W)
The power dissipation values for the MSC8102 are listed in Table 2-3. The ambient temperature for the
device is the air temperature in the immediate vicinity that would cool the device. The
junction-to-ambient thermal resistances are JEDEC standard values that provide a quick and easy
estimation of thermal performance. There are two values in common usage: the value determined on a
single layer board and the value obtained on a board with two planes. The value that more closely
approximates a specific application depends on the power dissipated by other components on the printed
circuit board (PCB). The value obtained using a single layer board is appropriate for tightly packed PCB
configurations. The value obtained using a board with internal planes is more appropriate for boards with
low power dissipation (less than 0.02 W/cm
2 with natural convection) and well separated components.
Based on an estimation of junction temperature using this technique, determine whether a more detailed
thermal analysis is required. Standard thermal management techniques can be used to maintain the device
thermal junction temperature below its maximum. If TJ appears to be too high, either lower the ambient
temperature or the power dissipation of the chip.
You can verify the junction temperature by measuring the case temperature using a small diameter
thermocouple (40 gauge is recommended) or an infrared temperature sensor on a spot on the device case
that is painted black. The MSC8102 device case surface is too shiny (low emissivity) to yield an accurate
infrared temperature measurement. Use the following equation to determine TJ:
Equation 2: TJ = TT + (θJA × PD)
where
TT = thermocouple (or infrared) temperature on top of the package (°C)
θ
JA = thermal characterization parameter (°C/W)
PD = power dissipation in the package (W)
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