參數(shù)資料
型號(hào)： MSC8102M4000
廠(chǎng)商： MOTOROLA INC
元件分類(lèi)： 數(shù)字信號(hào)處理
英文描述： 32-BIT, 75 MHz, OTHER DSP, CBGA431
封裝： 20 X 20 MM, FLIP CHIP, CERAMIC, BGA-431
文件頁(yè)數(shù)： 26/96頁(yè)
文件大?。?/td> 1557K
代理商： MSC8102M4000
2-2
Recommended Operating Conditions
2.3 Recommended Operating Conditions
Table 2-2 lists recommended operating conditions. Proper device operation outside of these conditions is
not guaranteed.
Table 2-3 describes thermal characteristics of the MSC8102 for the FC-CBGA (HCTE) package.
Section 4.1, Thermal Design Considerations provides a more detailed explanation of these
characteristics. AN2601/D MSC8102 Thermal Management Design Guidelines describes the thermal
performance of the MSC8102 under standard thermal test conditions and when mounted in a component
array. It also provides guidelines for evaluating board layouts that use MSC8102 devices.
Table 2-2. Recommended Operating Conditions
Rating
Symbol
Value
Unit
Core supply voltage
VDD
1.55 to 1.7
V
PLL supply voltage
VCCSYN
1.55 to 1.7
V
I/O supply voltage
VDDH
3.135 to 3.465
V
Input voltage
VIN
–0.2 to VDDH+0.2
V
Operating temperature range
TJ
TA
maximum: 105
minimum: –25
°C
Table 2-3. Thermal Characteristics for FC-CBGA (HCTE) Package
Characteristic
Symbol
FC-CBGA (HCTE) 20
× 20 mm5
Unit
Natural
Convection
100 ft/min
(0.5 m/s) airflow
200 ft/min
(1 m/s) airflow
Junction-to-ambient1, 2
RθJA or θJA
27
22
20
°C/W
Junction-to-ambient, four-layer board
1, 3
RθJA or θJA
15
12
11
°C/W
Junction-to-board (bottom)4
RθJB or θJB
4.4
°C/W
Junction-to-case5
RθJC or θJC
0.3
°C/W
Notes:
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer (1s) board horizontal.
3.
Per JESD51-6 with the board horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on the top
surface of the board near the package.
5.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
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