參數(shù)資料
型號(hào)： MSC8102M4000
廠商： MOTOROLA INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 32-BIT, 75 MHz, OTHER DSP, CBGA431
封裝： 20 X 20 MM, FLIP CHIP, CERAMIC, BGA-431
文件頁(yè)數(shù)： 25/96頁(yè)
文件大?。?/td> 1557K
代理商： MSC8102M4000
2-1
Chapter 2
Specifications
2.1 Introduction
This document contains detailed information on power considerations, DC/AC electrical characteristics,
and AC timing specifications. For additional information, see the MSC8102 User’s Manual and
MSC8102 Reference Manual.
In calculating timing requirements, adding a maximum value of one specification to a minimum value of
another specification does not yield a reasonable sum. A maximum specification is calculated using a
worst case variation of process parameter values in one direction. The minimum specification is
calculated using the worst case for the same parameters in the opposite direction. Therefore, a
“maximum” value for a specification never occurs in the same device with a “minimum” value for
another specification; adding a maximum to a minimum represents a condition that can never exist.
Table 2-1 describes the maximum electrical ratings for the MSC8102.
CAUTION
This device contains circuitry protecting against damage
due to high static voltage or electrical fields; however,
normal precautions should be taken to avoid exceeding
maximum voltage ratings. Reliability is enhanced if unused
inputs are tied to an appropriate logic voltage level (for
example, either GND or VDD).
Table 2-1. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Core supply voltage
VDD
–0.2 to 2.1
V
PLL supply voltage
VCCSYN
–0.2 to 2.1
V
I/O supply voltage
VDDH
–0.2 to 4.0
V
Input voltage
VIN
(GND – 0.2) to 4.0
V
Maximum operating temperature
TJ
105
°C
Minimum operating temperature
TA
–25
°C
Storage temperature range
TSTG
–55 to +150
°C
Notes:
1.
Functional operating conditions are given in Table 2-2.
2.
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not
guaranteed. Stress beyond the listed limits may affect device reliability or cause permanent damage.
3.
Section 4.1, Thermal Design Considerations, on page 1 includes a formula for computing the chip
junction temperature (TJ).
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