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| 型號： | MCC501RX200TD0B |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PBGA838 |
| 封裝： | BGA-838 |
| 文件頁數(shù)： | 68/102頁 |
| 文件大?。?/td> | 1929K |
| 代理商： | MCC501RX200TD0B |
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January 21, 2002 — Preliminary Version
C-Port Confidential
68
CHAPTER 3: ELECTRICAL SPECIFICATIONS
2 Thermal performance specifications based on following conditions:
Printed circuit board is based on the C-Ware Development System’s C-5 NP Switch
Module reference design, with specifications of:
– 14 total layers (5 planes). Planes at least 100mm x 100mm below the C-5 NP
before any interruptions.
– FR4 board material, Cu signal and plane material.
– 0.5mils signal layer thickness, 1.4mils plane layer thickness.
– Thermal resistance, board to ambient (
φ
BA) of 1.2
oC/W.
Custom heat sink design has the following characteristics:
– Dimensions: 100mm x 80mm x 10mm (height)
– Thermal resistance heat sink to ambient (
φ
SA) of 1.6
oC/W @200 LFM. Figure 10
provides the characteristic thermal resistance curve for this head sink for
various airflow rates.
– Thermal resistance case to heat sink (
φ
CS) of 0.03
oC/W (Chomerics T705 thermal
material).
– Note that target heat sink design is for low profile (10mm height) applications.
Significantly better thermal performance is possible with taller and/or wider
designs. Contact your C-Port representative for heat sink options.
3 Effective Thermal Resistance (
φ
effective = φJAφJB / (φJA + φJB)) reflects the total thermal
performance of the heat sink and board, as outlined in Note 2 above.
Figure 10 Thermal Performance for C-5 Network Processor Heat Sink (see step 2 above)
0
200
400
600
800
1000
0
1
2
3
Velocity (ft/min)
Th
ermal
R
esistan
ce
(C/W)
Theoretical calculation of thermal resistance as a function of airflow velocity across heat sink
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