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參數(shù)資料
| 型號(hào)： | MCC501RX200TD0B |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PBGA838 |
| 封裝： | BGA-838 |
| 文件頁(yè)數(shù)： | 67/102頁(yè) |
| 文件大?。?/td> | 1929K |
| 代理商： | MCC501RX200TD0B |
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C-Port Confidential
Preliminary Version — January 21, 2002
Power and Thermal Characteristics
67
Power and Thermal
Characteristics
Table 36 provides the derived power and thermal characteristics for the production
version (Revision D0) of the C-5 NP.
Notes for Table 36:
1 Estimated power dissipation (+/-10%) is derived from measurements on the C-5 NP
Revision D00 under following conditions:
BMU memory operating at 125MHz.
TLU memory operating at 133MHz.
V
DD = 1.8V, VDD33 = 3.3V, TJ at approximately 50
o C.
“Minimum” P
D based on idle condition (clocks running and no programs
executing).
“Typical” P
D based on test application that implements Fast Ethernet forwarding
actively running on all CPs.
“Maximum” P
D based on projected maximum consumption for any
high-bandwidth communications application executing on all CPs, FP, and XP.
Table 36 C-5 Network Processor Power and Thermal Characteristics
Parameter
Min
Typ
Max
Units
Test Conditions
Power Dissipation, P
D
10.5
11.5
12.5
14.5
15.0
16.0
17.5
20.0
18.0
19.0
20.5
23.0
W
166MHz core clock (See Note 1)
180MHz core clock (See Note 1)
200MHz core clock (See Note 1)
233MHz core clock (See Note 1)
Maximum Junction
Temperature, T
J
100
oC
Thermal Resistance, junction
to case,
φ
JC
0.24
oC/W
See Note 2
Thermal Resistance, junction
to ambient,
φ
JA
1.87
oC/W
See Note 2
Thermal Resistance, junction
to printed circuit board,
φ
JB
4.8
oC/W
See Note 2
Thermal Resistance, Junction
through Board to Ambient,
φ
JBA
6.0
See Note 2
Effective Thermal Resistance,
φ
effective
1.43
oC/W
See Note 3
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