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參數(shù)資料
| 型號： | DSP56366P |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 24-Bit Audio Digital Signal Processor |
| 中文描述： | 24位音頻數(shù)字信號處理器 |
| 文件頁數(shù)： | 97/110頁 |
| 文件大?。?/td> | 1273K |
| 代理商： | DSP56366P |
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DSP56366 Technical Data, Rev. 3.1
Freescale Semiconductor
5-1
5
Design Considerations
5.1
Thermal Design Considerations
An estimation of the chip junction temperature, T
J
, in
°
C can be obtained from the following equation:
Where:
T
A
R
qJA
= package junction-to-ambient thermal resistance
°
C/W
P
D
= power dissipation in package W
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance.
= ambient temperature
°
C
Where:
R
θ
JA
= package junction-to-ambient thermal resistance °C/W
R
θ
JC
= package junction-to-case thermal resistance °C/W
R
θ
CA
= package case-to-ambient thermal resistance °C/W
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, R
θ
CA
. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from R
θ
JA
do not satisfactorily answer whether
the thermal performance is adequate, a system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the junction-to-case thermal
resistance in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the
junction to the outside surface of the package (case) closest to the chip mounting area when that
surface has a proper heat sink.
T
J
T
A
P
D
R
θ
JA
×
(
)
+
=
R
θ
JA
R
θ
JC
R
θ
CA
+
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DSP56366UM | 24-Bit Audio Digital Signal Processor |
| DSP56367P | 24-Bit Audio Digital Signal Processor |
| DSP56367UM | 24-Bit Audio Digital Signal Processor |
| DSP56600 | Implementing Viterbi Decoders Using the VSL Instruction on DSP Families |
| DSP56852E | 16-bit Digital Signal Controllers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DSP56366UM | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Audio Digital Signal Processor |
| DSP56367 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Optoelectronic |
| DSP56367P | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Audio Digital Signal Processor |
| DSP56367UM | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Audio Digital Signal Processor |
| DSP56371 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:high density CMOS device |
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