參數(shù)資料
型號(hào): DSP56366P
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
元件分類: 數(shù)字信號(hào)處理
英文描述: 24-Bit Audio Digital Signal Processor
中文描述: 24位音頻數(shù)字信號(hào)處理器
文件頁數(shù): 28/110頁
文件大小: 1273K
代理商: DSP56366P
DSP56366 Technical Data, Rev. 3.1
3-2
Freescale Semiconductor
3.3
Thermal Characteristics
Operating temperature range
T
J
40 to +110
°
C
Storage temperature
T
STG
55 to +125
°
C
1
GND = 0 V, V
CC
= 3.3 V ± 0.16 V, T
J
= –40
°
C to +110
°
C, C
L
= 50 pF
2
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
3
CAUTION:
All “5 V Tolerant” input voltages must not be more than 3.95 V greater than the supply voltage; this restriction
applies to “power on”, as well as during normal operation. In any case, the input voltages cannot be more than 5.75 V. “5 V
Tolerant” inputs are inputs that tolerate 5 V.
Table 3-2 Thermal Characteristics
Characteristic
Symbol
LQFP Value
Unit
Junction-to-ambient thermal resistance
1, 2
Natural Convection
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
4
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
R
θ
JA
or
θ
JA
37
°
C/W
Junction-to-case thermal resistance
3
R
θ
JC
or
θ
JC
7
°
C/W
Thermal characterization parameter
4
Natural Convection
Ψ
JT
2.0
°
C/W
Table 3-1 Maximum Ratings (continued)
Rating
1
Symbol
Value
1, 2
Unit
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