參數(shù)資料
型號(hào): C5NPD0-DS
英文描述: QUAD BILATERAL SWITCH FOR TRANSMISSION OR MULTIPLEXING OF ANALOG OR DIGITAL SIGNALS
中文描述: 的C - 5網(wǎng)絡(luò)處理器的數(shù)據(jù)資料硅修訂D0
文件頁數(shù): 71/100頁
文件大?。?/td> 2163K
代理商: C5NPD0-DS
Power and Thermal Characteristics
71
MOTOROLA GENERAL BUSINESS INFORMATION
C5NPD0-DS/D REV 04
Notes for
Table38
:
1
Estimated power dissipation (+/-10%) is derived from measurements on the C-5 NP
Revision D00 under following conditions:
BMU memory operating at 125MHz.
TLU memory operating at 133MHz.
V
DD
= 1.8V, V
DD33
= 3.3V, T
J
at approximately 50
o
C.
Minimum
P
D
based on idle condition (clocks running and no programs
executing).
Typical
P
D
based on test application that implements Fast Ethernet forwarding
actively running on all CPs.
Maximum
P
D
based on projected maximum consumption for any
high-bandwidth communications application executing on all CPs, FP and XP
2
Thermal performance specifications based on following conditions:
Printed circuit board is based on the C-Ware Development System
s C-5 NP Switch
Module reference design, with specifications of:
14 total layers (5 planes). Planes at least 100mm x 100mm below the C-5 NP
before any interruptions.
FR4 board material, Cu signal and plane material.
0.5mils signal layer thickness, 1.4mils plane layer thickness.
Thermal resistance, board to ambient (
φ
BA
) of 1.2
o
C/W.
Custom heat sink design has the following characteristics:
Thermal Resistance, Junction
through Board to Ambient,
φ
JBA
Effective Thermal Resistance,
φ
effective
6.0
See Note 2
1.43
o
C/W
See Note 3
Table 38
C-5 Network Processor Power and Thermal Characteristics (continued)
PARAMETER
MIN
TYP
MAX
UNITS
TEST CONDITIONS
F
n
.
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