參數(shù)資料
型號: SAF7118H
廠商: NXP Semiconductors N.V.
元件分類: 通用總線功能
英文描述: Multistandard video decoder with adaptive comb filter and component video input
封裝: SAF7118EH/V1<SOT807-1 (HBGA156)|<<http://www.nxp.com/packages/SOT807-1.html<1<,;SAF7118EH/V1<SOT807-1 (HBGA156)|<<http://www.nxp.com/packages/SOT807-1.html<1<,;
文件頁數(shù): 163/175頁
文件大小: 898K
代理商: SAF7118H
SAF7118_4
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
163 of 175
NXP Semiconductors
SAF7118
Multistandard video decoder with adaptive comb filter
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 98
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 149
and
150
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 98
.
Table 149. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Table 150. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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