參數(shù)資料
型號: S70WS512N00BFWAA2
廠商: Spansion Inc.
英文描述: Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
中文描述: 同硅晶片堆疊多芯片產(chǎn)品(MCP)的512兆位(32兆× 16位)的CMOS 1.8伏,只有同時讀/寫,突發(fā)模式閃存
文件頁數(shù): 59/93頁
文件大小: 846K
代理商: S70WS512N00BFWAA2
60
S70WS512N00 Based MCPs
S70WS512N00_00_A0 March 14, 2005
A d v a n c e I n f o r m a t i o n
10 Power Conservation Modes
10.1
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby
mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the
high impedance state, independent of the OE# input. The device enters the CMOS standby mode
when the CE# and RESET# inputs are both held at V
CC
± 0.2 V. The device requires standard
access time (t
CE
) for read access, before it is ready to read data. If the device is deselected during
erasure or programming, the device draws active current until the operation is completed. I
CC3
in
DC Characteristics
represents the standby current specification
10.2
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption while in asynchronous
mode. the device automatically enables this mode when addresses remain stable for t
ACC
+ 20
ns. The automatic sleep mode is independent of the CE#, WE#, and OE# control signals. Stan-
dard address access timings provide new data when addresses are changed. While in sleep mode,
output data is latched and always available to the system. While in synchronous mode, the auto-
matic sleep mode is disabled. Note that a new burst operation is required to provide new data.
I
CC6
in
DC Characteristics
represents the automatic sleep mode current specification.
10.3
Hardware RESET# Input Operation
The RESET# input provides a hardware method of resetting the device to reading array data.
When RESET# is driven low for at least a period of t
RP
, the device immediately terminates any
operation in progress, tristates all outputs, resets the configuration register, and ignores all read/
write commands for the duration of the RESET# pulse. The device also resets the internal state
machine to reading array data. The operation that was interrupted should be reinitiated once the
device is ready to accept another command sequence to ensure data integrity.
When RESET# is held at V
SS
± 0.2 V, the device draws CMOS standby current (I
CC4
). If RESET#
is held at V
IL
but not within V
SS
± 0.2 V, the standby current is greater.
RESET# may be tied to the system reset circuitry and thus, a system reset would also reset the
Flash memory, enabling the system to read the boot-up firmware from the Flash memory.
10.4
Output Disable (OE#)
When the OE# input is at V
IH
, output from the device is disabled. The outputs are placed in the
high impedance state.
相關PDF資料
PDF描述
S70WS512N00BAWAA2 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAA3 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB0 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB2 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB3 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
相關代理商/技術參數(shù)
參數(shù)描述
S70WS512N00BFWAA3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BFWAB0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BFWAB2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
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