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參數(shù)資料
| 型號(hào)： | S70WS512N00BFWAA2 |
| 廠商： | Spansion Inc. |
| 英文描述： | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| 中文描述： | 同硅晶片堆疊多芯片產(chǎn)品（MCP）的512兆位（32兆× 16位）的CMOS 1.8伏，只有同時(shí)讀/寫，突發(fā)模式閃存 |
| 文件頁數(shù)： | 21/93頁 |
| 文件大?。?/td> | 846K |
| 代理商： | S70WS512N00BFWAA2 |
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22
S70WS512N00 Based MCPs
S70WS512N00_00_A0 March 14, 2005
A d v a n c e I n f o r m a t i o n
8 Device Operations
This section describes the read, program, erase, simultaneous read/write operations, handshak-
ing, and reset features of the Flash devices.
Operations are initiated by writing specific commands or a sequence with specific address and
data patterns into the command registers (see
Table 13.1
and
Table 13.2
). The command regis-
ter itself does not occupy any addressable memory location; rather, it is composed of latches that
store the commands, along with the address and data information needed to execute the com-
mand. The contents of the register serve as input to the internal state machine and the state
machine outputs dictate the function of the device. Writing incorrect address and data values or
writing them in an improper sequence may place the device in an unknown state, in which case
the system must write the reset command to return the device to the reading array data mode.
8.1
Device Operation Table
The device must be setup appropriately for each operation.
Table 8.1
describes the required state
of each control pin for any particular operation.
Legend:
L = Logic 0, H = Logic 1, X = Don’t Care, I/O = Input/Output.
8.2
Asynchronous Read
All memories require access time to output array data. In an asynchronous read operation, data
is read from one memory location at a time. Addresses are presented to the device in random
order, and the propagation delay through the device causes the data on its outputs to arrive asyn-
chronously with the address on its inputs.
The device defaults to reading array data asynchronously after device power-up or hardware re-
set. Asynchronous read requires that the CLK signal remain at V
IL
during the entire memory read
operation. To read data from the memory array, the system must first assert a valid address on
A
max
–A0, while driving AVD# and CE# to V
IL
. WE# must remain at V
IH
. The rising edge of AVD#
latches the address. The OE# signal must be driven to V
IL
, once AVD# has been driven to V
IH
.
Data is output on A/DQ15-A/DQ0 pins after the access time (t
OE
) has elapsed from the falling
edge of OE#.
Table 8.1 Device Operations
Operation
CE#
OE#
WE#
Addresses
DQ15–0
RESET#
CLK
AVD#
Asynchronous Read - Addresses Latched
L
L
H
Addr In
Data Out
H
X
Asynchronous Read - Addresses Steady State
L
L
H
Addr In
Data Out
H
X
L
Asynchronous Write
L
H
L
Addr In
I/O
H
X
L
Synchronous Write
L
H
L
Addr In
I/O
H
Standby (CE#)
H
X
X
X
HIGH Z
H
X
X
Hardware Reset
X
X
X
X
HIGH Z
L
X
X
Burst Read Operations (Synchronous)
Load Starting Burst Address
L
X
H
Addr In
X
H
Advance Burst to next address with appropriate Data
presented on the Data Bus
L
L
H
X
Burst
Data Out
H
H
Terminate current Burst read cycle
H
X
H
X
HIGH Z
H
X
Terminate current Burst read cycle via RESET#
X
X
H
X
HIGH Z
L
X
X
Terminate current Burst read cycle and start new Burst
read cycle
L
X
H
Addr In
I/O
H
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S70WS512N00BAWAA2 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70WS512N00BAWAA3 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70WS512N00BAWAB0 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70WS512N00BAWAB2 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70WS512N00BAWAB3 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S70WS512N00BFWAA3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70WS512N00BFWAB0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70WS512N00BFWAB2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70WS512N00BFWAB3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| S70Y | 功能描述:整流器 1600V 70A Std. Recovery RoHS:否 制造商:Vishay Semiconductors 產(chǎn)品:Standard Recovery Rectifiers 配置: 反向電壓:100 V 正向電壓下降: 恢復(fù)時(shí)間:1.2 us 正向連續(xù)電流:2 A 最大浪涌電流:35 A 反向電流 IR:5 uA 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-221AC 封裝:Reel |
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